Diffusion bonding techniques

Four essential process variables common to all diffusion bonding techniques are to be considered (1) temperature, (2) pressure, (3) time, (4) surface condition, and (5) process atmosphere. 

B.V. Cockeram, Flexural Strength and Shear Strength of Silicon Carbide to Sihcon Carbide Joints Fabricated by a Molybdenum Diffusion Bonding Technique, J. Am. Ceram. Soc., 88, 1892-99 (2005)... 

As an alternative to seals, irreversible bonding can be applied, e.g. by laser welding the surface of a microstructured stack [29, 30] or by diffusion bonding via vacuum compression of a microstructured stack [18, 37-39], For better handling and fluid interconnection, diffusion-bonded stacks may be surrounded by a shell [18, 37-39], Diffusion-bonded stacks typically are more compact. In addition, this interconnection technique is principally amenable to small-series production. Accordingly, it is seen as a proper way to realize future commercial, off-the-shelf micro reactors,... 

The microstructures were realized by a special, advanced turning technique [41]. The platelet stacks were diffusion bonded for sealing and encased in a housing by... 

A particular advantage of the transient liquid phase bonding technique is that the joints are produced at relatively low temperatures but have elevated service temperature capabilities comparable to those of diffusion bonded structures, (Locatelli et al. 1995). 

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