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Dielectric CMP

In-line metrology is a process control method suitable for regulating dielectric CMP. There are two major methodologies in use for in-line metrology wet and dry. Wet measurements involve immersing each wafer in DI water immediately after polishing it and measuring the amount... [Pg.35]

Slurry usage in CMP falls into three categories silicon polishing, dielectric CMP, and metal CMP. Within the latter two categories fall a variety of slurries depending on the specific material being polished. The chemistry and related issues are discussed elsewhere in this book. There are, however, a couple of points related to slurry that bear on CMP tool performance. [Pg.37]

G. Dishon, D. Eylon, M. Finarov, A. Shulman, Dielectric CMP Advanced Process Control Based on Integrated Thickness Monitoring, Third International CMP for ULSI Multilevel Interconnection Conference, Santa Clara, CA, pp. 267-274, Feb. 19-20, 1998. [Pg.45]

The most widely used pad for dielectric CMP is ICIOOO, a class III material [2]. A micrograph of ICIOOO pad microstructure is given in Fig. 7. A summary of material property data taken from a large volume analysis [18] is given in Table V. [Pg.170]

Seike Y, Lee FI, Takaoka M, Miyachi K, Amari M, Doi T, Philipossian A. Development of a pad conditioning process for interlayer dielectric CMP using high-pressure micro jet technology. J Electrochem Soc 2006 153(3) G223-G228. [Pg.199]

W over dielectric) CMP slurry or a multiple-step CMP process combining a high-selectivity W CMP slurry with an oxide CMP slurry. [Pg.531]

Dielectric CMP is used to planarize intermetal dielectrics (IMD) (represented by ILDl, ILD2, or ILD3) and premetal dielectrics (represented by ILDO). The slurry typically used in this process is at high pH (10-12), KOH or NH4OH based and silica abrasive. The hydroxide ion is needed to hydrolyze the substrate, which in this case is Si02-... [Pg.433]

I. Ali and S. Roy, Pad conditioning in interlayer dielectric CMP, Solid State Technol, June 1997. [Pg.175]

In the advanced semiconductor technology node, dielectric CMP is no longer a simple dielectric planarization process. The applications of dielectric CMP technology... [Pg.3]


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See also in sourсe #XX -- [ Pg.3 ]




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Interlayer dielectrics CMP

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