Degradation by Thermal Oxidation Processes

During thermal degradation of PAN over the temperature range 150-590 °C, gaseous and volatile products were produced with simultaneous stabilisation of the stmcture of the residual material. The principal 

The thermooxidative degradation and SiOx film formation of poly(vinyl imidazole-co-vinyl trimethoxysilane) on copper was investigated. Thermal degradation of the copolymer was catalysed by copper in the film and at the substrate surface. Copper in the copolymer film contributed to the formation of a copper-containing SiOx film during thermal degradation. Copper oxides in the film interacted with the SiOx film to form a copper-rich phase near the film defects and cracks (142). 

The thermooxidative degradation of polyphenylene bibenzimidazole (PBl) and a blend of PBl with Ultem 1000 polyetherimide was investigated. The ETIR spectra of the blend were analysed by subtraction spectroscopy, allowing the fate of the two blend components to be selectively studied. No chemical interaction between the two components was detectable by FTIR spectroscopy during the degradation process (323). 

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