Curing agents 2-methylimidazole

Other latent curing agents that are used in solid adhesives are dihydrazides and BF3-MEA complexes. These compositions are also stable at room temperature but cure when heated. Solid anhydrides can be used in one-component powder blends (e.g., 10 pph of trimellitic anhydride accelerated with 0.5 pph of 2-methylimidazole). Solid systems with aromatic diamines are prepared by comelting the solid epoxy with the amine. Typically 30 pph of curing agent is used.1... 

EINECS 213-234-5 EMl-24 2-Ethyl-4-methylimidazole Imidazole, 2-ethyl-4-methyl- IH-lmidazoie, 2-ethyi-4-methyl- 4-Methyi-2-ethylimidazole NSC 82315. A curing agent for epoxy resins used in low proportions thus improving chemical resistance. Crystals mp = 36-42° bp = 292-295° d 0,9750 soluble in H2O (18,0 g/100 ml), organic solvents. Lancaster Synthesis Co,... 

The hardener portion (Part B) may also be mixed with fillers, diluents, solvents, and other additives. Fillers may be mixed in the resin portion alone or partly in the resin and partly in the hardener portion. Adhesion promoters such as Dow Corning A-180 silane may also be added to enhance the adhesion of the filler particles to the resin or hardener. Examples include several electrically conductive epoxy formulations that were used to evaluate their electrical stability on non-noble metal surfaces. The base epoxy resin was the diglycidylether of bisphenol-F (DGEBF, equivalent wt. = 170 g). Methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, and 4-methylphthalic anhydride were evaluated as curing agents with 4-methylimidazole as a catalyst. The manufacturing procedure was ... 

As an example for an epoxy resin, diglycidyl ether of bisphenol-A (Epon 828 by Yuka Shell Epoxy Co. Ltd.) was cured with 2-ethyl -4-methylimidazole or N,N-dimethylbenzylamine. The concentration of the curing agent was changed from 0.05 to 0.2 molar ratio. The curing temperature was changed from 40 C to 80 C. 

Methylenebis (3-chloro-2,6-diethylaniline) 4,4 -Methylenebis 2,6-diethylaniline curing agent, epoxies Adipic acid dihydrazide 1-[(2-Aminoethyl) aminol-2-propanol Aminoethylpiperazine Aniline 3,3, 4,4 -Benzophenone tetracarboxylic dianhydride Benzyl alcohol N-Benzyidimethylamine Bis (p-aminocyclohexyl) methane Bis-hexamethylenetriamine Boron trifluoride 1-(2-Cyanoethyl)-2-ethyl-4-methylimidazole 1,2-Diaminocyclohexane 3,4-Diaminotoluene Diazabicycloundecene Didecyl methylamine... 

Methylimidazole (EMI) n. An epoxy-resin curing agent with a heterocyclic structure. EMI is used with epoxies formed from epichlorohydrin and bisphenol A or -F, and for novolac epoxy resins. It provides ease of compounding, long pot life, low viscosity, and non-staining characteristics. 

Imidazoles such as 2-methylimidazole (2-MI) and 2-phenylimidazole (2-PI) contain both a cyclic secondary and a tertiary amine fiinctional groups and are used as catalysts, catalytic curing agents, and accelerators (124,125). They are widely used as catalysts for DICY-cured epoxies in electrical laminates. For powder coatings, 2-MI adducts of LER are often used to facilitate dispersion of the components in powder coating formulations and to enhance shelf-life. Other modified imidazoles are also commercially available. The main advantage of imidazoles is the excellent balance of pot life and fast cure. 2-PI is used to increase Tg and thermal resistance. 

The most commonly nsed curing agent for PWBs is dicyandiamide (DICY) catalyzed with imidazoles snch as 2-methylimidazole (2-MI), followed by phenolic novolacs and anhydrides. 

Ethyl-4-Methylimidazole n (EMI) An epoxy resin curing agent with the heterocyclic structure. 

The amount of catalyst used may vary from 2 to 10 parts per 100 parts resin. To determine the best ratio of catalyst to resin, several different catalyst levels should be evaluated to determine which level provides maximum properties. Several common catalytic curing agents are benzyldimethylamine (BDMA), boron trifluoride monoethylamine (BF3 MEA), and 2-methylimidazole (2-MI). 

Compounds such as 2-methylimidazole 41, 2-undecylimidazole, 2-ethyl-4-methylimidazole 42 are highly reactive materials. It has been stated that soluble imidazoles are too reactive to permit their use in one-part adhesive systems stable at ambient temperature [12]. Among the other compounds, the less reactive 4-phenylimidazole 43 would be a convenient curing agent at elevated temperature, alfliough file reaction still occurs over a few days of storage at 25 C. 4-Methyl-... 

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