Cure procedures

The tubular positive plate uses rigid, porous fiber glass tubes covered with a perforated plastic foil as the active material retainer (Fig. 2). Dry lead oxide, PbO, and red lead, Pb O, are typically shaken into the tubes which are threaded over the grid spines. The open end is then sealed by a polyethylene bar. Patents describe a procedure for making a type of tube for the tubular positive plate (90) and a method for filling tubular plates of lead—acid batteries (91). Tubular positive plates are pickled by soaking in a sulfate solution and are then cured. Some proceed directiy to formation and do not requite the curing procedure. 

On the whole, curing procedures appear a promising way to obtain very stable polymer films. Thus, the structure of already mentioned polylysine has been revised as a block polymer involving either the a or e amino groups of lysine Vitamin Bj2 modified carbon electrodes were prepared by thermal curing of a mixture of a diamino functionalized derivative 5 and an epoxy prepolymer 6 of the araldite... 

Wood and wood composites Solid wood as well as particleboard and medium-density fiberboard (MDF) are suitable substrates for powder coating. They tend to emit volatiles such as entrapped air and moisture, and therefore require curing temperatures below 100°C (212°F) and preferably nof higher than 80°C (144°F). A typical curing procedure for MDF is in Table 7.8. 

For the same polymer and curing procedure, networks formed in the presence of various diluents (

Kinetic theory requires C

volume fraction of polymer during solution cure), assuming comparable numbers of crosslinks per primary molecule are introduced. Experimentally C,

state cures, although they do decrease somewhat in the more dilute curing systems (q> < 0.2). Solution cured polydimethyl siloxane networks show similar behavior in their dry state moduli (275). 

Once promising resins have been identified, application procedures must be optimized. Such factors as add-on, composition of any mixtures method of application, drying and curing procedure, and the placement of the resin on the appropriate sites in the object must be arranged to give the best possible combination of textile properties. 

Draining of Consolidants Effect of Concentration. As noted in the introduction, one objective of the studies described here is to examine techniques for applying consolidants under conditions that will reduce the physical hazards to which the fabric substrate is exposed. Since the acrylic resins examined in Part II of this series (I) have outstanding resistance to degradation from UV light and heat and normally do not yellow or stiffen under adverse conditions, some of these resins were re-examined using a much less severe application technique. Milder curing procedures also were utilized. 

The overall conclusion from the Rapra studies was that Potential migration of laminating adhesive components is only likely to be of concern if an inappropriate type of adhesive has been selected for a particular application. This assumes that correct adhesive mixing and curing procedures are used . 

PYROBAN ND can be applied from a pad bath at room temperature. Usually 15% to 20% (OWE) is sufficient to produce an excellent fire retardant finish on nylon. Ammonium sulfate is the catalyst that must be used with PYROBAN ND. Use 4% ammonium sulfate based on the total amount of PYROBAN ND being used. The goods should be dried and cured following regular resin curing procedures. 

CNC COMPOSITE is applied to the fabric by standard pad-dry-cure procedures. 

INTEX SCOUR 125 is also very efficient for use in general drug room clean-up, and for this appliaction may be cut 1 1 with water and used in normal curing procedures. 

Spln-on and Cure Procedure. The spln-on applications of SOG were carried out with a manual photoresist spinner (Headway, Carrolton, Texas) under a laminar flow hood. In order to minimize the splash back problem, spray of the substrate by the mist or droplets formed by the SOG solution thrown off against the spinner bowl wall, it was necessary to apply a downward exhaust through the bottom of the bowl. The films were spun on 3 in. or 4 in. diameter single-crystal silicon wafers using an acceleration of 20,000 rpm/sec and a spin-time of 20 sec. at the desired speed. For most of the characterizations, the SOG film was cured at 100 C for 15 min. followed by 400°C for 60 min. in ambient air. 

The electrical and optical properties as well as the device lifetime should not be negatively affected by the curing procedure. 

FIGURE 2.1.7 Casting and curing procedures for fabrication of the air-gap transistor stamps. The recessed gate electrode is separated from the conductive channel by a micron-size gap. (From Menard, E. et al., Adv. Mater., 16, 2097, 2004.)... 

These experiments clearly show that the presence of residual solvent (after the standard cure procedure) is the main reason for the sometimes considerable differences in properties. The time/temperature necessary to remove the residual solvent is determined by the sample dimensions and the viscosity of the resin system. The boiling temperature of the residual solvent seems to be less important. 

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