CSP Mold

Keywords Heat Flux, CSP Mold, Casting Speed, Superheat, Level Fluctuation. 

The CSP mold was vertical type and the 70mm thick. Two steel grades were studied, including LCAK steel and weathering steel, the compositions of which are shown in Table 1. And the mold flux powders used are listed m Table 2. The industrial production data over three months was used and analyzed. 

The mean heat flux of CSP mold was studied based on the plant production data of LCAK steels... 

Flex interposer-based CSPs. This CSP type uses a flexible circuit having solder balls or metal bumps as an interconnect interposer between the chip and the next circuit board level. The bare chip is attached facedown and wire-bonded to the interposer. A thin elastomer, sandwiched between the chip and interposer, cushions the chip and the solder-ball interconnects, relieving stresses (see Fig. 1.13). The interposer generally consists of a metallized, flexible polyimide tape on which are formed electrical connections by photolithographic processes. As a final step, the exposed wire bonds and edges of the chip are molded with epoxy. 

Thin-core laminate, low-loop wire bond, and standard over-mold Thinnest available package (0.5 mm mounted height), and JEDEC MSL 1 Extremely thin CSP , etCSP (Amkor) EEPROM devices, PCMCIA card appHcations, and minidisk drives... 

Polyimide tape, die and wire bond, over-mold Near CSP FBGA-T (ChipPAC) DSPs, memory products, ASICs, and SRAMs, cell phones, and pagers... 

Polyimide layer for redistribution traces, over-molded 30% reduction in board area, 65% thinner profile. Super CSP (Fujitsu) Flash memory and ASIC... 

STUDY OF HEAT FLUX IN CSP CONTINUOUS CASTING MOLD... 

In the current work, the characteristics of the mean heat flux at four faces of a CSP continuous casting mold at steady casting stage were studied based on the plant production data of low carbon A1 killed (LCAK) steel and weathering steel (WS). The effect of various operation parameters, including casting speed, siqierheat in tundish and surface level fluctuation at the mold on the heat flux was analyzed and discussed... 

Study of Heat Flux in CSP Continuous Casting Mold.227... 

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