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Cross-link density properties

During the vulcanization, the volatile species formed are by-products of the peroxide. Typical cure cycles are 3—8 min at 115—170°C, depending on the choice of peroxide. With most fluorosihcones (as well as other fluoroelastomers), a postcure of 4—24 h at 150—200°C is recommended to maximize long-term aging properties. This post-cure completes reactions of the side groups and results in an increased tensile strength, a higher cross-link density, and much lower compression set. [Pg.400]

The compression set of sihcone mbber is similar to organic types of mbber at low (0—50°C) temperatures, ranging from 5 to 15% (380). Above 50°C, sihcone mbber is superior, but compression set increases with time and temperature. Sihcone mbber is more tear-sensitive than butyl mbber, and the degree of sensitivity is a function of filler size and dispersion, cross-link density, and curing conditions. The electrical properties of sihcone mbber are generally superior to organic mbbers and are retained over a temperature range from —50 to 250°C (51). Typical electrical values for a heat-cured sihcone mbber are shown in Table 9. [Pg.54]

The conventionally covalently cross-linked rubbers and plastics cannot dissolve without chemical change. They will, however, swell in solvents of similar solubility parameter, the degree of swelling decreasing with increase in cross-link density. The solution properties of the thermoelastomers which are two-phase materials are much more complex, depending on whether or not the rubber phase and the resin domains are dissolved by the solvent. [Pg.87]

Other material properties that are of general interest to the polymer chemist are shown in Table 3. Linear toluene swell is indicative of cross-link density in the material. The vinyl-phenyl modified rubber showed the lowest degree of swell. This is due to additional cross-links introduced by the vinyl groups during synthesis. The unmodified rubber was found to swell considerably in toluene and was found to dissolve partially in the solvent. [Pg.107]

The absorption of moisture critically affects other important resin properties, particularly those associated with low-dielectric and thermomechanical applications. Results of a 96-h boiling water immersion test are presented in Table 2.2. The moisture absorbed decreased substantially with fluoromethylene chain length from n = 3 to n = 6, followed by only modest decreases for n = 8 and 10. This latter behavior was somewhat unexpected and may be the effect of decreased cross-link density counteracting the increased fluorine content. These 100°C measurements are just above the glass transition and the situation may be different at room temperature. These measurements are in progress. [Pg.33]

A product of this type will have over 50% of its weight derived from maleic anhydride. This very high content of reactive double bonds will lead to a very brittle solid when it is cross-linked with styrene. Without further modification, this solid material will have very high tensile moduli, probably over 600 kpsi, but a very low tensile elongation, way below 1 %. Such a brittle material obviously has only very limited applications. Thus, for most general-purpose applications, it is necessary to incorporate some chemically inert components to soften the polymer backbone. This will reduce the cross-linking density and improve the physical properties of the cured solid. [Pg.702]

Some work has been done to correlate oxide CMP performance with pad properties [46]. This work indicated that the specific gravity of the pads and the cross-linking densities affect polish performance. Other work has been done to correlate CMP performance with slurry composition [47]. This work suggests that the friction during polish is proportional to the removal rate when the abrasive content is greater than 10%, and inversely proportional to the removal rate when it is less than 10%. [Pg.26]


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Cross-linking density

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