Conductive adhesives conclusions

In conclusion, it is worthwhile to note that in 1970-71, when I started to be involved with tannin adhesives, there were no more than three laboratories, academic or industrial, conducting research on tannin adhesives. By 1986, I have had direct or indirect contact with 42 different laboratories in many countries that have carried out at some time, or are now carrying out, research on these bonding materials. The increase in industrial usage has also been fast but for various reasons has lagged behind the technical and scientific interest. However, after practically zero consumption in 1970, indications are that about 12,000 tons of exterior-grade tannin resin solids per year are now produced and consumed in the timber industry based on reliable information from several... 

Studies have been conducted on the effects of corrosive salt-spray environment on bondlines of different bonded systems. The system variations included clad and bare alloys, surface treatments, adhesive primers, and adhesives. Five specimens were fabricated for each of the bonded systems. The specimens were then placed in a salt-spray environment of 5% NaCl at 35 °C. The change in wedge-test crack length of each specimen was recorded periodically. At the end of 1 month, one specimen was randomly selected from each bonded system and opened for visual inspection of the bondline condition, both in the stressed zone (crack-tip zone) and in the unstressed zone. The same procedure was carried out after 2, 3, 6, and 12 months, when the last specimen was removed from test. The conclusions were as follows... 

The conclusion that can be drawn from these experiments is that the use of highly priced fillers such as diamond powder does not improve the thermal conductivity better than less expensive materials such as aluminium nitride, boron nitride, boron carbide, or sdicon carbide. Within certain limits, the higher the X value of the filler particles, the higher the thermal conductivity of the adhesives with respect to the X/Xp ratio that exhibits a favourable optimized value at about 100. This means that fillers with a thermal conductivity in the range... 

This chapter describes the adhesive technologies used in the electrical industry with an introduction to the conduction mechanisms in adhesive joints, the specific requirements for the application of adhesives in electronics, and reliability evaluation methods. This chapter could be summarized with the following conclusions. 

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