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Conduction flat plate

Soo has also analyzed the boundary-layer motion with electrostatic forces. Considering flow of uniformly charged particles over a conductive flat plate that is also charged, the equations for the fluid, particles, and potential V can be written as... [Pg.147]

Fig. 5. Profile of conduction heat transfer across the gap between a sphere and a flat plate vs projected radius, R = 3 mm, of the sphere at 40°C and 2.1... Fig. 5. Profile of conduction heat transfer across the gap between a sphere and a flat plate vs projected radius, R = 3 mm, of the sphere at 40°C and 2.1...
To illustrate the usefulness of such an algorithm, and the seriousness of the issue of thermal conductivity degradation to the design and operation of PFCs, the algorithm discussed above has been used to construct Fig. 9 [34], which shows the isotherms for a monoblock divertor element in the unirradiated and irradiated state and the "flat plate" divertor element in the irradiated state. In constmcting Fig. 9, the thermal conductivity saturation level of 1 dpa given in Fig. 8 is assumed, and the flat plate and monoblock divertor shown are receiving a steady state flux of... [Pg.409]

Hoeppner pointed out that until the early 1970s, most investigators conducted fatigue tests utilising rotating bending, flat plate bending or... [Pg.1052]

The major use for flat plate evaporators is to cool a solid product by conduction, the product being formed in rectangular packages and held close between a pair of adjacent plates. [Pg.89]

In all cooled appliances, the heat from the device s heat sources must first arrive via thermal conduction at the surfaces exposed to the cooling fluid before it can be transferred to the coolant. For example, as shown in Fig. 2.2, it must be conducted from the chip through the lid to the heat sink before it can be discharged to the ambient air. As can be seen, thermal interface materials (TIMs) may be used to facilitate this process. In many cases a heat spreader in the form of a flat plate with high thermal conductivity may be placed between the chip and the lid. [Pg.8]

Transient Heat Conduction. Our next simulation might be used to model the transient temperature history in a slab of material placed suddenly in a heated press, as is frequently done in lamination processing. This is a classical problem with a well known closed solution it is governed by the much-studied differential equation (3T/3x) - q(3 T/3x ), where here a - (k/pc) is the thermal diffuslvity. This analysis is also identical to transient species diffusion or flow near a suddenly accelerated flat plate, if q is suitably interpreted (6). [Pg.274]

Assessment of membrane damage was based on performance testing before and after chemical exposure. Testing was conducted in a small flat plate reverse osmosis unit designed to accommodate membrane discs of 45 mm diameter. Feed solution reservoir temperature was maintained at 25 1°C and the brine was continuously recirculated through a filter at the rate of 600 mL/min. Concentration polarization is considered negligible in this cell under these conditions. [Pg.175]

A much larger experiment is conducted with the flat-plate test. Pin techniques are... [Pg.482]

The inclined corrugations provide more coalescing surface than flat plates and also provide a concave channel for the oil to flow up inlu oil gutters. These gutters conduct the oil to the top of the separator where it is skimmed from the surface. [Pg.185]

As with previous methods, artificially layered deposits may be obtained from a single chemical solution using a specially designed cell, for instance, with adjustable anode-cathode gap (see Fig. 17.3). This two-compartment cell may be constructed from Lucite with deposition conducted in one compartment, and KC1 solution placed in the other. A calomel reference electrode immersed in this KC1 solution should be coupled to the flat-plate cathode by a salt bridge, ending in a capillary on the deposition side. The specimen electrode is fixed, and the counter-electrode is movable using, say, a micrometer. Electrodeposition is best conducted under quiescent conditions. [Pg.267]

Heat Conduction across a Flat Solid Slab Solve the problem of heat transfer across an infinitely large flat plate of thickness H, for the following three physical situations (a) the two surfaces are kept at T and T2, respectively (b) one surface is kept at T while the other is exposed to a fluid of temperature Tb, which causes a heat flux q,, h = 2( 2 — Tb),h2 being the heat-transfer coefficient (W/m2-K) (c) both surfaces are exposed to two different fluids of temperatures Ta and Tb with heat-transfer coefficients h and hi, respectively. [Pg.77]

Fig. 5.5 Temperature profiles for unsteady-state heat conduction in finite flat plates T(x, 0) = To, T( b, t) = 7j. [Reprinted by permission from H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd ed., Oxford University Press, New York, 1973.]... Fig. 5.5 Temperature profiles for unsteady-state heat conduction in finite flat plates T(x, 0) = To, T( b, t) = 7j. [Reprinted by permission from H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd ed., Oxford University Press, New York, 1973.]...
Composite Plate. The heat flux through a flat plate comprising of, for example, three layers of material of different thickness b, b2 and b3, each with its own thermal conductivity, k, k2 and k3, respectively, and the outside surfaces being held at T0 and T3, is given by... [Pg.99]

Consider a steady, laminar boundary layer flow of incompressible, transparent fluid along a flat plate, with a constant applied heat flux qw Btu/(hr ft2) at the wall surface. The properties of the fluid are assumed constant. The main considerations are conduction to the fluid, and radiation from the plate to the environment at Te. Surface of the plate is opaque and gray, and the uniform emissivity is 8. The fluid which is at a temperature of T,, flows at a uniform velocity of Uo. Flow velocities are sufficiently small so that viscous dissipation may be neglected. [Pg.284]

Let us first consider the simple flat plate with a liquid metal flowing across it. The Prandtl number for liquid metals is very low, of the order of 0.01. so that the thermal-boundary-layer thickness should be substantially larger than the hydrodynamic-boundary-layer-thickness. The situation results from the high values of thermal conductivity for liquid metals and is depicted in Fig. 6-15. Since the ratio of 8/8, is small, the velocity profile has a very blunt shape over most of the thermal boundary layer. As a first approximation, then, we might assume a slug-flow model for calculation of the heat transfer i.e., we take... [Pg.305]

Conduction of heat through a solid of constant cross section (example, a large flat plate)... [Pg.587]


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See also in sourсe #XX -- [ Pg.340 , Pg.345 ]




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