Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Heat flow computations

A. K. Singhal, L. W. Keeton, A. K. Majundar, and T. Mukerjee,M Improved Mathematical Formulation for the Computations of Flow Distributions in Manifolds for Compact Heat Exchangers, paper presented at The ASME Winter Annual Meeting, Anaheim, Calif., 1986, p. 105. [Pg.501]

A young scientist said, I have never seen a complex scientific area such as industrial ventilation, where so little scientific research and brain power has been applied. This is one of the major reasons activities in the industrial ventilation field at the global level were started. The young scientist was right. The challenges faced by designers and practitioners in the industrial ventilation field, compared to comfort ventilation, are much more complex. In industrial ventilation, it is essential to have an in-depth knowledge of modern computational fluid dynamics (CFD), three-dimensional heat flow, complex fluid flows, steady state and transient conditions, operator issues, contaminants inside and outside the facility, etc. [Pg.1]

W/nr-°C)- (0.95 (Btu/h-ft -T) ). Thus the heat flow will be q = (21 - 0)°C/0.163(W/m -°C)" = 128.8 W/m (40.8 Btu/h-iT), or fourteen times as much as that through the insulated wall. It is interesting to note that the heat flow through an ancient window made from a piece of oilskin, or even a window made from a piece of computer paper, would not increase by more than 2 percent from that of the glass window, because the resistance of the glass is so small. [Pg.615]

Thermal resistance is the reciprocal of thermal conductance. It is expressed as m KTW. Since the purpose of thermal insulation is to resist heat flow, it is convenient to measure a material s performance in terms of its thermal resistance, which is calculated by dividing the thickness expressed in meters by the thermal conductivity. Being additive, thermal resistances facilitate the computation of overall thermal transmittance values (t/-values). [Pg.112]

Complicated problems of transient heat flow can be resolved by computer. Typical time-temperature curves for non-steady cooling are shown in Figures 16.1 and 16.2, and the subject is met again in Section 26.2. [Pg.12]

Hypercubes and other new computer architectures (e.g., systems based on simulations of neural networks) represent exciting new tools for chemical engineers. A wide variety of applications central to the concerns of chemical engineers (e.g., fluid dynamics and heat flow) have already been converted to run on these architectures. The new computer designs promise to move the field of chemical engineering substantially away from its dependence on simplified models toward computer simulations and calculations that more closely represent the incredible complexity of the real world. [Pg.154]

Equation demonstrates that a change of temperature accompanies a heat flow. The equation is also used to compute the amount of heat transferred in a specific temperature change, as Example shows. [Pg.365]

The availability of a phase space probability distribution for the steady state means that it is possible to develop a Monte Carlo algorithm for the computer simulation of nonequilibrium systems. The Monte Carlo algorithm that has been developed and applied to heat flow [5] is outlined in this section, following a brief description of the system geometry and atomic potential. [Pg.67]

We use differential scanning calorimetry - which we invariably shorten to DSC - to analyze the thermal properties of polymer samples as a function of temperature. We encapsulate a small sample of polymer, typically weighing a few milligrams, in an aluminum pan that we place on top of a small heater within an insulated cell. We place an empty sample pan atop the heater of an identical reference cell. The temperature of the two cells is ramped at a precise rate and the difference in heat required to maintain the two cells at the same temperature is recorded. A computer provides the results as a thermogram, in which heat flow is plotted as a function of temperature, a schematic example of which is shown in Fig. 7.13. [Pg.150]

The large amount of calorimetric data, which can be conveniently stored in a digital form, may, of course, be used in a computer to solve the general equation for the heat transfer in a heat-flow calorimeter (Section IV.B) ... [Pg.224]

All modern heat flow calorimeters have twin cells thus, they operate in the differential mode. As mentioned earlier, this means that the thermopiles from the sample and the reference cell are connected in opposition, so that the measured output is the difference between the respective thermoelectric forces. Because the differential voltage is the only quantity to be measured, the auxiliary electronics of a heat flux instrument are fairly simple, as shown in the block diagram of figure 9.3. The main device is a nanovoltmeter interfaced to a computer for instrument control and data acquisition and handling. The remaining electronics of a microcalorimeter (not shown in figure 9.3) are related to the very accurate temperature control of the thermostat and, in some cases, with the... [Pg.141]

If, as illustrated in figure 12.6, the isothermal starting lines of the various curves do not coincide, then A< >o, A< cai, and Aheat transfer change between runs, for example, due to a variation in the purge gas flow or the fact that it is virtually impossible to relocate the crucible containing the sample exactly in the position used for the calibrant run (normally the reference crucible remains in place throughout a series of runs). Note that a similar correction should have been used in the computation of heat flow or area quantities if, in the example of figure 12.4, the isothermal baselines of the main experiment and the zero line were not coincident. [Pg.183]

Use of medium-scale heat flow calorimeter for separate measurement of reaction heat removed via reaction vessel walls and via reflux condenser system, under fully realistic processing conditions, with data processing of the results is reported [2], More details are given elsewhere [3], A new computer controlled reaction calorimeter is described which has been developed for the laboratory study of all process aspects on 0.5-2 1 scale. It provides precise data on reaction kinetics, thermochemistry, and heat transfer. Its features are exemplified by a study of the (exothermic) nitration of benzaldehyde [4], A more recent review of reaction safety calorimetry gives some comment on possibly deceptive results. [5],... [Pg.368]

If the thermocouple wires are located in a hole or groove in a metal tube or plate, the fin effect will be remedied, but the heat flow pattern through the solid will be altered. The correct surface temperature can be computed by the relaxation method. This corrected method has been used for boiling studies (S2), but many workers have made no correction for embedded wires. [Pg.56]

CHEMICAL STABILITY/REACTIVITY ASSESSMENT COMPUTATION OF REACTIVE CHEMICAL HAZARDS EXOTHERMIC DECOMPOSITION REACTIONS HEAT FLOW CALORIMETRY HIGH RATE DECOMPOSITION MAXIMUM REACTION HEAT... [Pg.2253]

The heat flow dissipated by the central heater is then calculated by measurement of current and voltage (see section 9.3). The thermal conductivity is then computed based on the heat flow, temperature gradient, and known radial distances. The outer furnace then heats the contents to a higher (e.g. 100°C) temperature and the process repeats. The thermal conductivity of the specimen as a function of temperature is thus determined by a series of isothermal steps. [Pg.230]

The thermal transmission apparatus (togmeter) described by Clulow and Rees (27.) uses a heated plate and standardized conducting disks in series with the specimen to compute the heat flow through the textile. Thermal resistance can be measured by using one or two plates, thus simulating various modes of fabric end use,... [Pg.261]

The block is 1 m square. Compute the temperatures of the various nodes as indicated in Fig. 3-9 and the heat flows at the boundaries. [Pg.87]

The heat flows at the boundaries are computed in two ways as conduction flows for the 100 and 500°C faces and as convection flows for the other two faces. For the 500°C face, the heat flow into the face is... [Pg.92]


See other pages where Heat flow computations is mentioned: [Pg.439]    [Pg.439]    [Pg.477]    [Pg.129]    [Pg.106]    [Pg.52]    [Pg.162]    [Pg.187]    [Pg.282]    [Pg.218]    [Pg.68]    [Pg.152]    [Pg.169]    [Pg.174]    [Pg.181]    [Pg.410]    [Pg.124]    [Pg.225]    [Pg.405]    [Pg.477]    [Pg.88]    [Pg.2564]    [Pg.175]    [Pg.110]    [Pg.59]    [Pg.299]    [Pg.395]    [Pg.847]    [Pg.6]    [Pg.91]    [Pg.11]   
See also in sourсe #XX -- [ Pg.255 ]




SEARCH



Computation of the Heat Transfer Coefficient for External Flow

© 2024 chempedia.info