Compression test specimen configurations

For the particular case where the entire rectangular beam of the DCDC specimen is made of a homogeneous brittle solid with elastic modulus Eg and 

Poisson ratio the energy release rate for fracture is estimated to be 

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Plastic deformation is commonly measured by measuring the strain as a function of time at a constant load and temperature. The data is usually plotted as strain versus time. Deformation strain can be measured under many possible loading configurations. Because of problems associated with the preparation and gripping of tensile specimens, plastic deformation data are often collected using bend and compression tests. 

D-4501. Test Method for Shear Strength of Adhesive Bonds Between Rigid Substrates by the Block-Shear Method. Fig. 9 shows the two specimen configurations and the test head for this new, general-purpose, compression shear test which should be suitable for testing adhesives for plastics, metals, glass, wood, and other substrates. 

To avoid severe fiber breakage, the fibers were added to the PP melt (T= 190 °C, kneader revolution 50 rpm, mixing time = 3 min) and homogenized for additional 5 min. Composite test sheets were produced from the compounds by compression molding. Specimens cut of the sheets were subjected to static (subscript s ) and dynamic (subscript d ) flexural tests using the 3-point bending configuration. Static tests were carried out at a deformation rate of 1 mm/min. 

The configuration of the creep test specimen is usually made the same as the standard tensile test specimen for static testing. Creep data are generally determined in tension, but creep strains can be measured in compression, shear, or bending also. 

The corrosion property of contact interface between the conductive polymer with 40 wt% carbon particle and Au plated printed circuit board was examined under a corrosive environment of H2S 3 ppm for 1000 hours at 40 c and 80 % relative humidity. The specimen arrangement is shown in Figure 1 two printed circuit boards hold the conductive polymer in a sandwich configuration at a deformation rate of 20 % in compression. After 1000 hours test, to evaluate the air - tight property of the polymer on the Au plated circuit board, discoloration and contact resistance for the surface of Au plate were examined. The contact resistance was measured by using Au probe with 1 mm/ as the other contact member under flowing a current of 0.15 mA and a contact load of 10 g. Corroded parts due to defects in the Au plate show a high level contact resistance because of contaminant films. On the contrary, for the uncorroded part, contact resistance is maintained at a low level. Therefore, contact resistance measurements can be used to evaluate the corrosion of the contact surface. 

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