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Composites formaldehyde modified wood

The production of moisture resistant particleboard by treatment with a maleic anhydride -glycerol mixture and using phenol formaldehyde as the matrix material has been investigated (Fujimoto etal., 1987). Boards prepared from modified wood showed considerable improvements in modulus of elasticity and internal bond strength when compared to control boards. Composites made from aspen fibres modified with SA, MA or acetic anhydride using phenol-formaldehyde (PF) or polypropylene as binder have also been studied (Clemons etal., 1992 Rowell etal., 1993b). The reaction of wood with MA was found to proceed at a slower rate than with SA. The volume increase due to modification... [Pg.81]

Although the use of simple diluents and adulterants almost certainly predates recorded history, the use of fillers to modify the properties of a composition can be traced as far back as eady Roman times, when artisans used ground marble in lime plaster, frescoes, and po22olanic mortar. The use of fillers in paper and paper coatings made its appearance in the mid-nineteenth century. Functional fillers, which introduce new properties into a composition rather than modify pre-existing properties, were commercially developed eady in the twentieth century when Goodrich added carbon black to mbber and Baekeland formulated phenol— formaldehyde plastics with wood dour. [Pg.366]

Various commercial adhesives have been used to provide bond strength with nylon on the order of 250 to 1000 psi. Priming of nylon adherends with a composition based on resorcinol formaldehyde, isocyanate modified rubber, and cationic surfactants has been reported to provide improved joint strength. Some epoxy, resorcinol formaldehyde, phenol-resorcinol, and rubber-based adhesives have been found to produce satisfactory joints between nylon and metal, wood, glass, and leather. Exposure of nylon 6 to oxygen and helium plasmas for 30 s to 1 min improved the adhesion of two-part epoxy adhesives.66... [Pg.371]

However, lignin may find application as a suitable wood-composite adhesive in adhesive formulations if chemically modified in some manner. In this respect, the recent developments with soda bagasse lignin-resorcinol-formaldehyde and lignin-isocyanate adhesives allow for some cautious optimism for the future. [Pg.27]

A wide range of adhesive types and chemistries are used to bond wood elements to one another (Table 2), but relatively few adhesive types are utilized to form the composites themselves. The vast majority of pressed-wood products use synthetic thermosetting adhesives. In North America the most important wood adhesives are the amino resins (qv), eg, urea-formaldehyde (UF) and melamine-formaldehyde (MF), which account for 60% by volume of adhesives used in wood composite products, followed by the phenolic resins (qv) eg, phenol-formaldehyde (PF) and resorcinol-formaldehyde (RF), which account for 32% of wood composite adhesives (12,13). The remaining 9% consists of cross-linked vinyl (X-PVAc) compounds, thermoplastic poly(vinyl acetates) (PVA), soy-modified casein, and polymeric diphenylmethylene diisocyanate (pMDI). Some products may use various combinations of these adhesives to balance cost with performance. [Pg.9264]

The phenolic family of adhesives are very diverse in their formulations and uses. Some are filled or modified with other polymers (vinyl, nitrile or epoxy). The composition depends largely on the intended use, e.g. for temperature and chemical resistance, or for water-proof wood bonding (phenol-resorcinol-formaldehyde). The majority are heat-curing although some wood-bonding adhesives can be cured at room temperature (RT). The comparison table includes Typical Use to differentiate between the types of adhesives. Phenolic adhesives are generally poorly represented by mechanical property data. [Pg.241]


See other pages where Composites formaldehyde modified wood is mentioned: [Pg.122]    [Pg.92]    [Pg.581]    [Pg.520]    [Pg.135]    [Pg.236]    [Pg.355]    [Pg.99]    [Pg.467]    [Pg.806]    [Pg.9275]    [Pg.160]    [Pg.315]   
See also in sourсe #XX -- [ Pg.95 ]




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