Ceramics grinding damage

Clarke, L. R., Chou, C.-H., Khuri-Yakub, B. T., and Marshall, D. B. (1985). Acoustic evaluation of grinding damage in ceramic materials. IEEE 1985 Ultrasonics Symposium, pp. 979-82. IEEE, New York. [273]... 

Grinding of Ceramics with Attention to Strength and Depth of Grinding Damage... 

B. J. Hockey, Observations by transmission electron microscopy on the subsurface damage produced in aluminum oxide by mechanical polishing and grinding, Proc. Br. Ceram. Soc. 1972,20,95-115. 

Kovach, J.A., Blau, P.J., Malkin, S., Srinivasan, S., Bandyopadhyay, B., and Ziegler, K., 1993, A feasibility investigation of high speed, low damage grinding process for advanced ceramics, 5th Int. Grinding Conf, Vol. I, SME. 

Spur, G. and Tio, T.H., 1988, Surface layer damage in grinding of advanced engineering ceramics, Trans. NAMRC/SME XVI, pp. 224-231. 

Kirchner, H.P. and Conway, J.C., 1985, Mechanisms of material removal and damage penetration during single point grinding of ceramics. Machining of Ceramic Materials and Components, ASME, New York, Vol. 17, pp. 53-61. 

It is well known that the material removal mechanism in the grinding of ceramics is mainly a brittle fracturing process and grinding induced damage in terms of microcracks has been observed in various ceramics. Ceramic materials are very sensitive to cracks due to their low fracture toughness. The principal induced crack systems are the lateral cracks and the median cracks. The lateral cracks are parallel to the ground surface, and the median... 

Surface grinding was employed to determine the groimd strength of the ceramics and the depth of damage caused by the grinding process. Two... 

The lapping and strength testing approach can be used to experimentally determine the effective depth of damage caused by grinding of ceramics. 

The grinding process often results in surface fracture damage nullifying the benefits of advanced ceramic processing methods (Bandyopadhyay and Ohmori, 1999). These defects can significantly reduce the strength and reliability of the finished component and are sensitive to grinding parameters. 

G. Subhash, M. A. Marszalek and S. Maiti, Sensitivity of Scratch Resistance to Grinding Induced Damage Anisotropy in Silicon Nitride"./ Am. Ceram. Soc., 89 (8), 2528-2536 (2006). 

The greatest amount of material removal is achieved with bonded diamond grinding disks. Progressively lower rates of removal are associated with polycrystal-hne diamond suspensions, monocrystalline diamond suspensions, diamond sprays, diamond pastes, SiC papers, and AI2O3 slurries (in that order). However, as the rate of material removal increases, so does the amount of damage caused to the sample smface. In the case of relatively soft or porous ceramics, it can be practical to use an... 

Like grinding with bonded grains, lapping is intended to eliminate surface irregularities and damages in the ceramic sample. It can be used for the preparation steps... 

Koepke, B.G., 1972. An assessment of surface and subsurface damage introduced in ceramics by semifinish grinding operations. NBS Spec. Publ, Nr. 348, p. 317. 

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