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Ceramic reliability

Lamon J. Ceramics reliability statistical analysis of multiaxial failure using the Weibull approach and the multiaxial elemental strength model. Journal of the TVmeiican Ceramic Society 1990 73(8) 2204-2212. [Pg.193]

Lamon, (. (1990) Ceramics reliability statistical analysis of muhiaxial failure using the WeihuH approach and the miiltiaxial elemental strength. /. Am. Ceram. Soc., 73 (8), 2204-2212. [Pg.572]

Ceramics and composites for engine applications Design and life prediction methodologies Environmental effects on mechanical properties Mechanical behavior of porous ceramics Reliability of small scale systems Ultra high temperature ceramics Ternary compounds... [Pg.347]

Advanced Processing Concepts for Increased Ceramic Reliability... [Pg.2]

Fligh-tech ceramics withstand great mechanical stresses even thin structures and sharp edges are feasible with high reliability. This allows connecting the HT cables reliably to the ceramic part of the tubes directly. Many available resin systems bond easily to ceramics. [Pg.534]

X-ray tubes are used in a broad variety of technical applications the classical application certainly is the radiographic inspection. For the penetration of high-Z materials, relatively high power is required. This lead to the development of X-ray tubes for laboratory and field use of voltages up to 450 kV and cp power up to 4,5 kW. Because of design, performance and reliability reasons, most of these maximum power stationary anode tubes are today made in metal-ceramic technology. [Pg.535]

An advantage of the use of ceramics over the use of glass as an insulator in X-ray tubes is the larger freedom in design due to better stability and more reliable quality of the ceramics. Therefore, typical markets for metal-ceramic tubes are applications where only a relatively low amount of tubes, but in special designs, are used. [Pg.535]

Reliability performance of new equipment profit from the innovative metal-ceramic concept. [Pg.537]

Materials handbooks list data for Dq and Q for various atoms diffusing in metals and ceramics Table 18.1 gives some of the most useful values. Diffusion occurs in polymers, composites and glasses, too, but the data are less reliable. [Pg.184]

SIMS is one of the most powerful surface and microanalytical techniques for materials characterization. It is primarily used in the analysis of semiconductors, as well as for metallurgical, and geological materials. The advent of a growing number of standards for SIMS has gready enhanced the quantitative accuracy and reliability of the technique in these areas. Future development is expected in the area of small spot analysis, implementation of post-sputtering ionization to SIMS (see the articles on SALI and SNMS), and newer areas of application, such as ceramics, polymers, and biological and pharmaceutical materials. [Pg.548]

This is another property for which it is very difficult to obtain a reliable figure. In general, ceramic materials are not very resistant to impact and should be guarded to prevent breakage by accidental blows. [Pg.909]

Other methods of determining the hardness of a material include a variety of "penetration" tests that yield hardness values measured in scales known as the Brinell, Rockwell (B or C), and scleroscope scales. These scales provide reliable hardness values for most materials, including ceramics, glass, metals and alloys, and wood (see Table 21). Unfortunately, as can be seen in the table, the various tests provide somewhat different hardness values for the same materials. [Pg.113]

In Table 4-2, we have the standard SMD component sizes. Note that usually, most pick and place machines cannot mount anything bigger than size 1515. So larger components may need to be hand-soldered. For ceramic capacitors, reliability requirements call for a certain... [Pg.109]

Pricing as well as reliability considerations have led to an almost exclusive use of Si-based (i.e. Si and SOI) micro machined devices. Packaging and assembly has focused on ceramics (A1203, AIN, Low Temperature Co-fired Ceramics LTCC), Printed Circuit Board (PCB-) and Surface Mount Device (SMD-) technology and multichip modules (MCM s). [Pg.200]


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See also in sourсe #XX -- [ Pg.27 ]




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