Brazing solid-state

Use Solid-state electronic devices (transistors, diodes), semiconducting applications, brazing alloys, phosphors, gold and beryllium alloys, infrared-transmitting glass. 

As with soft metal gaskets, volatile components in the braze alloy (including phosphorus) should be avoided. A special subset of brazing is solid-state brazing, or intermetaUic diffusion. This occurs spontaneously, albeit slowly, when miscible metals are placed in direct contact. Examples of suitable metals for solid-state brazing to the membrane and module include copper, iron, silver, and nickel [7]. 

Solid-state brazing is simply a process of solid-state diffusion. Solid-state brazing occurs at a rate which is temperature dependent, meaning that less time is required to achieve a satisfactory solid-state diffusion bond at higher temperatures. To realize diffusion times of the order of a few hours, the temperature should be at least 500 °C, perhaps 600 °C and the parts (membrane and adjacent... 

Solid state bonding Metallizing + brazing Active brazing Ceramic frit process... 

Scott Weilz, K Yong Kim, J. and Hardy, J.S. (2005) Reactive air brazing A novel method of sealing SOFCs and other solid-state electrochemical devices. Electrochemical and Solid-State Letters, 8 (2), 133-136. 

J. D. Buckley and B. A. Stein Eds., Joining Technologies for the 1990s Welding, Brazing, Soldering, Mechanical, Explosive, Solid-state, Adhesive, Noyes Data Corporation, Park Ridge, NJ, 1986. 

To overcome these issues, an alternative brazing technique has been developed specifically for use in fabricating solid-state electrochemical devices [74]. Referred to as air brazing, the technique employs a molten oxide that is at least partially soluble in a noble metal solvent to promote wetting of the ceramic sealing surface. Due to its ability to dissolve in the noble metal liquid, the oxide compound serves as an in situ oxygen buffer, raises the chemical activity of dissolved oxygen, and enhances... 

There are three general categories or types of joining processes. In the first, attachment is mechanical and is achieved through the use of mechanical interlocking of components. The second approach is direct joining, in which components are bonded either by a solid-state process or by fusion. The third approach could be referred to as indirect joining in the sense that an intermediate layer of material, such as an adhesive, cement, or braze, is used to bond two components. 

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