Baking curve

Fig. 36 Dispersion of Pigment Violet 19, (l-modification, in an alkyd-melamine resin baking enamel with a paint shaker. Reduction 1 2 with Ti02. Tinctorial strength-time curve.

The resist formulation was spin-coated onto a silicone wafer on which a bottom antireflective coating had been previously applied and then soft-baked for 60 seconds at 90°C on a hot plate to obtain a film thickness of 1000 nm. The resist film was then exposed to i-line radiation of 365 nm through a narrowband interference filter using a high-pressure mercury lamp and a mask aligner. Experimental samples were then baked for 60 seconds at 90°C on a hot plate and developed. The dose to clear, E0, which is the dose just sufficient to completely remove the resist film after 60 seconds immersion development in 2.38% aqueous tetramethyl ammonium hydroxide, was then determined from the measured contrast curve. Testing results are provided in Table 1. 

The change in absorbance at the maximum in the 255 - 270 nm region of films baked for various periods of time at 140, 110 and 90 °C are shown in Figure 7. All of the data were fit to curves of the form of Equation 5. The reaction rate results are summarized in Table I for both the early (up to twenty hours) and the latter portions of the curves (beyond twenty hours). 

Since It Is known that moisture Increases the overall reaction rates for both paper and fabric (25 - 27). It was postulated that the early rapid rise In absorption might be due to moisture In the films. Therefore, film samples stored In air at about 55% RH for at least 24 hr prior to baking at 140 °C were compared with samples stored In a desiccator. One set of samples was taken from film as received, one set from water-washed film, and one set from film treated with NaBH. The results of this Investigation are given In Table II. As before, all of the data were fit to curves of the form of Equation 5. The reaction rates are given In Table II. 

Figure 4.12 Adsorption isotherms for krypton on gold obtained using TSM devices in a vacuum chamber. Curve A was at 90°K before baking while Curve B was at 96°K after baking the gold film at 3S0°C for 12 hours. (Reprinted with petmUsion. See Ref. [106].)...

Figure 6. Cure curves calculated with roller model for four systems, under "normal" bake schedule. Nominal temperature 180 °C, beating time constant 30 sec.

Figure 1 shows the ultraviolet (UV) spectra of an unexposed MP2400-17 film and a film exposed to 470 mJ/cm. The films were spin coated onto quartz substrates and baked at 90 C for 30 minutes in a forced-air oven. The film thickness after baking was 0.465 bm. Exposure was accomplished by direct irradiation of the film to the narrowed output of a Math Sciences EXL-100 KrF excimer laser. Thirty pulses were delivered at an average dose of 15.7 mj/cm per pulse. The spectrum of the quartz substrate was automatically subtracted from the spectra of the films on the substrates to obtain Figure 1. The absorbance of the two films is the same at wavelengths below 310 nm and the solid curve in Figure 1 represents the absorbance of both films. The absorbance at 248 nm is 0.49 for both films. Destruction of the PAG by the 248 nm radiation, as evidenced by the disappearance of the longer wavelength absorption in the irradiated film, presumably occurs after nonradiative energy transfer.

Figure 8. Sensitivity curves for brominated derivatives of poly(TMSP) after postexposure baking for 1 h at 140 °C. Sample designations are explained in the caption to Figure 2.

---