Application Example I High-Temperature MID

In addition to the temperature-shock and humidity heat tests common in MID engineering, but with degrees of severity adapted to the automotive application, the project also included steady-state high-temperature tests at 125 and 150 °C. The samples were also subjected to mechanical loading in vibration tests, partly because the high proportions of fillers in the plastics were expected to cause reduced adhesion of the metallization. Supplementing the numerous tests for plastics char- 

Plate - 1 mm Plato - 2 mm Ribbed body Plug cage 

FIGURE 6.17 Test program in the framework of the HT-MID research project for qualification of high-temperature MID [190] 

Another research project examined the reliability of press-in connections as a viable alternative connection technique for injection-molded interconnect devices. Unlike the project outlined above, in which the test program and selected methods were tailored to the object of examination, a test program set out in DIN EN 60352 Part 5 was definitive for qualification of the reliability of press-in pins. See Fig. 6.18. The test program is subdivided here into an assessment program for basic qualification of individual connections and an application program for checking connections that are part of a component/parent system. 

Test of the parts and vicinity of the holes in the interconnect device 

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