Advanced Silicon Etching process

Advanced silicon etching (ASE ) Bosch Vanderbilt University, Nashville, TN, USA process DRIE (Deep reactive ion etching) ... 

The equipment used in the unit operations is complex and microprocessor controlled to allow the execution of process recipes. However, advanced control schemes are rarely invoked. The microprocessor adjusts set points according to some sequence of steps defined by the equipment manufacturer or the process operator. Flows, pressures, and temperatures are regulated independently by off-the-shelf proportional-integral-derivative controllers, even though the control loops interact strongly. For example, fluorine concentration, substrate temperature, reactor pressure, and plasma power all influence silicon etch rates and uniformity, but they are typically controlled independently. 

A Systematic Study and Characterization of Advanced Corrosion Resistance Materials and Their Applications for Plasma Etching Processes in Semiconductor Silicon Wafer Fabrication... 

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