Adhesives chemically curing systems

Silicone adhesives are generally applied in a liquid and uncured state. It is therefore the physical and chemical properties of the polymers, or more precisely of the polymer formulation, that guide the various processes leading to the formation of the cured silicone network. The choice of the cure system can be guided by a variety of parameters that includes cure time and temperature, rheological properties in relation with the application process, substrates, the environment the adhesive joints will be subjected to and its subsequent durability, and of course, cost. 

There are many applications for silicone adhesives, sealants, or coatings where the condensation curing systems are not suitable. This is because they are relatively slow to cure, they require moisture to cure that can itself be in some cases uncontrollable, and they evolve by-products that cause shrinkage. Adhesives needed in automotive, electronics, microelectronics, micro electromechanical systems, avionic, and other hi-tech applications are usually confined to vei7 small volumes, which can make access to moisture difficult. Also, their proximity to very sensitive mechanical or electronic components requires a system that does not evolve reactive chemicals. 

The chemical bonding theory of adhesion applied to silicones involves the formation of covalent bonds across an interface. This mechanism strongly depends on both the reactivity of the selected silicone cure system and the presence of reactive groups on the surface of the substrate. Some of the reactive groups that can be present in a silicone system have been discussed in Section 3.1. The silicone adhesive can be formulated so that there is an excess of these reactive groups, which can react with the substrate to form covalent bonds. It is also possible to enhance chemical bonding through the use of adhesion promoters or chemical modification of the substrate surface. 

The blocked isocyanate systems (with curative present) are latent cure systems. In order to create a latent curing adhesive, the blocked isocyanate is added to a catalyzed polyol component without a reaction occurring at room temperature. In theory, the blocked adhesive system is relatively stable at room temperature. When this system is heated to the unblocking temperature, the chemical reaction, which... 

Compared to the chemically cured adhesive systems in common use today, this enzymatic binder has certain advantages ... 

Room-temperature-vulcanizing silicone rubber (General Electric and Dow Corning) is available at hardware stores and is very useful as an adhesive and sealant. Atmospheric moisture is necessary to effect the cure, so broad areas of impermeable materials should not be cemented with these preparations. The uncured material evolves acetic acid, and the cured material appears to lose some weight in high vacuum but if used with moderation, it can be considered a satisfactory vacuum sealant for most chemical vacuum systems. 

Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. However, the resistance to a specific environment is greatly dependent on the type of epoxy curing agent used. Aromatic amine (e.g., metaphenylene diamine) cured systems are frequently preferred for long-term chemical resistance. 

The adhesive may be solvent or water-based, hot-melt, coldseal or heatseal and pressure sensitive or chemically reactive. So the solidification process may occur via drying of water or solvent-based adhesives, by cooling of hot-melt and heat-seal adhesives, or by curing of chemically-reactive systems. With two notable exceptions - self-adhesive labels used on items of fruit or vegetables, and heat-sealable layers on packaging films - adhesives are in general not intended to touch the packaged food directly. 

The disadvantages of UV adhesives are that one transparent substrate is normally required they suffer from oxygen inhibition and only a limited depth of cure can be achieved. The latter problem has been tackled by the development of dual-cure adhesives. In these systems, two independent curing mechanisms are incorporated into a single system. Thus the adhesive is cured first to a chemically stable form by UV irradiation and subsequently led to fiiU cure by a second means, for example, thermal cure. 

Uses Unsat. polyester resin comonomer chemical intermediate for paints, light-colored alkyds, plasticizers, adhesives, pesticides hardener for resins curing system additive for bisphenol A-epichlorohydrin epoxies for food contact... 

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