Adhesion promotor

Another indication of hydrolysis is shown by the KR. spectrum Figure II. The change in -CH3 absorption at 2980 cm" at room temperature was followed with a F.T.I.R. employing time lapse technique(7). 3) Functional groups that will interact with acid must be present to obtain maximum adhesion. This conclusion is supported by the fact that epoxy and amine containing silanes are all excellent adhesion promotors as shown in Table V. 

GRAMS OF ADHESION PROMOTOR ADDED TO FORMULATION (TABLE 3)... 

Now, the adhesion of polymer to metal presents no difficulty poor adhesion of the polymer to the bare metal substrate is improved through the use of silane adhesion promotors(1-7). These are... 

Sadly, such adhesion promotors are not available for the adhesion of metal being deposited onto a polymer surface. Here, one must rely entirely on reactions provoked by the deposition process to provide the adhesion. This requires a thorough understanding of both the polymer surface and the deposition process. 

At the same time it was assumed that interaction of the amino groups of the silane should act as additional adhesion promotor to the polyimide surface. The use of the y-aminopropyl methyl triethoxy silane together with diepoxides (Araldite GY 266) did not improve the brittleness remarkably. The use of AMDES, however, should lead to less brittle systems due to the only two-dimensional crosslinking ability of the diethoxy silane. The basic structure formation features are given in Fig. 10. 

The patterning steps are based on photolithography (Figure 4.26). In this procedure, a photosensitive compound known as a photoresist is first spin-coated onto the surface of the wafer. Frequently, the wafer is pretreated by a dehydration bake (to remove adsorbed water) and application of an adhesion promotor e.g., hexamethyl disilazane, HMDS - used to maintain a strong interaction between the photoresist and Si02 surface - Figure 4.27). 

The WFg H2 System. The reaction WFg + 3H2 W + 6HF is possible from 300 to 800 °C and is also used in thin-film production. There are several disadvantages in comparison to the other reduction methods. The HF formed during the reaction may cause defects, like encroachment or wormholes. The layers show poor adhesion on native Si02, which is always present on Si. Therefore, tungsten is not directly deposited on Si but on a bilayer. One layer provides an ohmic contact with Si, and the other acts as an adhesion promotor for W. 

Acylated Diamines and Poly amines and Their Salts Uses and properties similar to those above. Products of the type (RCONHCH2-CH2)2NH are used as adhesion promotors for asphalt coating of wet or damp road surfaces. 

Special Uses. High molecular mass copolyester resins are used in the manufacture of flexible packaging. Terephthalate resins are particularly suitable as adhesion promotors for printing inks, lacquers, and adhesives on poly(ethylene terephthalate) films. Some polyester printing inks adhere directly to these sheets. Lacquers that can be heat sealed at relatively low temperature can be produced from high molecular mass, soft copolyester resins. Special linear copolyester resins are used for magnetic tape coatings [2.97]. 

Alterations in polyamic acid-polyimide surfaces produced by the use of different methods of curing (oven vs. hot plate), the application of a silane adhesion promotor (y-aminopropyltriethoxysilane), and the deposition of copper have been studied using ESCA. Our objective was to develop chemical state information (elemental composition, chemical bonding features) about the modifications occurring in the outermost few tens of angstroms of polyimide films. The results show different C Is spectral features for hot plate vs. oven cured films but identical stoichiometries. The silane treated amic acid surface... 

Uses modifier and adhesion promotor for film-forming natural and synthetic resins in vinyl lacquers, nitrocellulose compositions (nail lacquers), polyvinyl alcohol adhesives, acrylics. TOSYLAMIDE/FORMALDEHYDE RESIN... 

Adhesion promotors Silanes, titanates Block and graft copolymers ... 

P. E. Cassidy and B. J. Yager, A review of coupling agents as adhesion promotors, NASA Contract NASA 24073, Tracor Inc. (Sept. 1969). 

W. Thiedman, F. C. Tolan, P. J. Pearce, and C. E. M. Morris, Silane coupling agents as adhesion promotors for aerospace structural film adhesives, J. Adhes. 22, 197 (1987). 

In a general approach the styrene evaporation suppressants are dissolved in the UPRs. It is soluble in the resin, i.e., in the solution of imsaturated polyester in styrene and in styrene itself as well. It is, however, insoluble in the polyester. In the course of processing, styrene monomer evaporates from the surface and the suppressant forms a thin film, which exhibits barrier properties in relation to styrene. This mechanism is well known as far as solution of paraffin wax in UPRs is concerned. Nevertheless, paraffin wax cannot be applied as a styrene evaporation suppressant because of its antiadhesive properties and the decrease in interlaminar adhesion in glass fiber reinforced UPRs. Thus, a suitable styrene evaporation suppressant should contain an adhesion promotor with a waxy consistence. 

G.K. Cowell and D.J. Cherry, Metal deactivators as adhesion promotors for vulcanizable elastomers to metals, US Patent 4306930, assigned to Ciba-Geigy Corporation (Ardsley, NY), December 22,1981. 

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