Organosilane adhesion promoters

Hybrid Circuits. The use of parylenes as a hybrid circuit coating is based on much the same rationale as its use in circuit boards. A significant distinction Hes in obtaining adhesion to the ceramic substrate material, the success of which determines the eventual performance of the coated part. Adhesion to the ceramic must be achieved using adhesion promoters, such as the organosilanes. 

Abstract— The use of organosilanes as adhesion promoters for surface coatings, adhesives and syntactic foams is described and reviewed in the light of published work. Data are presented on the beneficial effect of silanes, when used as pretreatment primers and additives, on the bond strength of two pack epoxide and polyurethane paints applied to aluminium and mild steel. It is shown that silanes when used as additives to structural epoxide and polyurethane adhesives are less effective than when used as pretreatment primers on metals but are highly effective on glass substrates. The compressive properties of glass microballoon/epoxide syntactic foams are shown to be markedly improved by the addition of silanes. 

Adhesion promotion Improved adhesion between unreactive inorganic or organic substrates and resin matrix Adhesion promoter in form of a primer solution or as a polymer additive. Sometimes used with organosilanes... 

Accelerates peroxide and air-based cures (e.g., polyester SMC/BMC) adhesion promoter and primer for organic substrates Adhesion promoter for printing inks on treated polyolefin films Comparable to organosilanes at lower cost Adhesion promoters and primers for treated polyolefins... 

Fig. 31. 8 Increase in the delamination velocity as a function of mechanical stress in the blister test experiment measured with the HR-SKP comparison of an unmodified epoxy adhesive (as in Fig. 31.2, about 70 p,m thick) and of the adhesive modified with an organosilane adhesion promoter, performed with 0.5 M NaCi as electrolyte.

Thin adhesion-promoting layers based on bifunctional organosilanes for iron, zinc, and aluminum with a thickness of about 50-100 nm (Fig. 41b). Especially, van Ooij and coworkers developed various adhesion-promoting systems based on this technology [193-195]. 

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