Adhesion loss stresses

Rheometric Scientific markets several devices designed for characterizing viscoelastic fluids. These instmments measure the response of a Hquid to sinusoidal oscillatory motion to determine dynamic viscosity as well as storage and loss moduH. The Rheometric Scientific line includes a fluids spectrometer (RFS-II), a dynamic spectrometer (RDS-7700 series II), and a mechanical spectrometer (RMS-800). The fluids spectrometer is designed for fairly low viscosity materials. The dynamic spectrometer can be used to test soHds, melts, and Hquids at frequencies from 10 to 500 rad/s and as a function of strain ampHtude and temperature. It is a stripped down version of the extremely versatile mechanical spectrometer, which is both a dynamic viscometer and a dynamic mechanical testing device. The RMS-800 can carry out measurements under rotational shear, oscillatory shear, torsional motion, and tension compression, as well as normal stress measurements. Step strain, creep, and creep recovery modes are also available. It is used on a wide range of materials, including adhesives, pastes, mbber, and plastics. 

The modulus of elasticity can also influence the adhesion lifetime. Some sealants may harden with age as a result of plasticizer loss or continued cross-linking. As a sealant hardens, the modulus increases and more stress is placed on the substrate—sealant adhesive bond. If modulus forces become too high, the bond may faH adhesively or the substrate may faH cohesively, such as in concrete or asphalt. In either case the result is a faHed joint that wHl leak. 

Good wetting is of course not a sufficient criterion for good contact adhesion because it takes no account of the factors that influence the mechanical loss factor, C, in Eq. 8, nor does it account for residual stress development during cure. But aside from these factors, one might inquire into the validity of the correlation between practical contact adhesion and VEa beyond 0° contact angle , i.e. can any distinction be made based on VEa between different adhesives, all of which perfectly wet the adherend ... 

Viscoelastic polymers essentially dominate the multi-billion dollar adhesives market, therefore an understanding of their adhesion behavior is very important. Adhesion of these materials involves quite a few chemical and physical phenomena. As with elastic materials, the chemical interactions and affinities in the interface provide the fundamental link for transmission of stress between the contacting bodies. This intrinsic resistance to detachment is usually augmented several folds by dissipation processes available to the viscoelastic media. The dissipation processes can have either a thermodynamic origin such as recoiling of the stretched polymeric chains upon detachment, or a dynamic and rate-sensitive nature as in chain pull-out, chain disentanglement and deformation-related rheological losses in the bulk of materials and in the vicinity of interface. 

In practice, thermal cycling rather than isothermal conditions more frequently occurs, leading to a deviation from steady state thermodynamic conditions and introducing kinetic modifications. Lattice expansion and contraction, the development of stresses and the production of voids at the alloy-oxide interface, as well as temperature-induced compositional changes, can all give rise to further complications. The resulting loss of scale adhesion and spalling may lead to breakaway oxidation " in which linear oxidation replaces parabolic oxidation (see Section 1.10). 

Fortunately the oxidation of many metals takes place by the diffusion of the metal cation . This flux is outwards through the oxide layer, and the work of adhesion" enables the loss of metal to be compensated for by a drift of the oxide towards the metal (Fig. 1.81). Thus the stresses set up in the maintenance of oxide/metal contact are compressive and, as such, can be more readily withstood by most oxides. Nevertheless, it is these general movements of the oxide scale which are ultimately responsible for discontinuities in the majority of cases and it is appropriate to discuss transport-induced flows before proceeding any further. 

It was pointed out in Section 26.2.1 that the friction coefficient is considerably larger on a rough track than on a smooth one when the log ajv values of the master curve are small, i.e., when the temperature is high, and the speed is low, i.e., when the viscoelastic losses are low. Moreover, the adhesion friction, which enables tangential stresses to be built up, is low. 

Loss of theoretical adhesive strength can also arise from the action of internal stress concentrations caused by trapped gas and voids. Griffith11 showed that adhesive joints may fail at relatively low stress if cracks, air bubbles, voids, inclusions, or other surface defects occur as a result of the curing process. 

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