Adhesion dissipation

W. R. Grace Co. dielectric and conductive adhesives, encapsulants, heat dissipating materials, manufacturing aid coatings... 

Fig. 2. Schematic of energy dissipation in a commonly used peel test. The energy dissipation can occur in the adhesive and/or the adherends. The extent of energy dissipation depends on the elasto-plastic properties of the adhesive and the adherends under the test conditions as well as the local stresses and strains near the crack tip.

Viscoelastic polymers essentially dominate the multi-billion dollar adhesives market, therefore an understanding of their adhesion behavior is very important. Adhesion of these materials involves quite a few chemical and physical phenomena. As with elastic materials, the chemical interactions and affinities in the interface provide the fundamental link for transmission of stress between the contacting bodies. This intrinsic resistance to detachment is usually augmented several folds by dissipation processes available to the viscoelastic media. The dissipation processes can have either a thermodynamic origin such as recoiling of the stretched polymeric chains upon detachment, or a dynamic and rate-sensitive nature as in chain pull-out, chain disentanglement and deformation-related rheological losses in the bulk of materials and in the vicinity of interface. 

As is true for macroscopic adhesion and mechanical testing experiments, nanoscale measurements do not a priori sense the intrinsic properties of surfaces or adhesive junctions. Instead, the measurements reflect a combination of interfacial chemistry (surface energy, covalent bonding), mechanics (elastic modulus, Poisson s ratio), and contact geometry (probe shape, radius). Furthermore, the probe/sample interaction may not only consist of elastic deformations, but may also include energy dissipation at the surface and/or in the bulk of the sample (or even within the measurement apparatus). Study of rate-dependent adhesion and mechanical properties is possible with both nanoindentation and... 

Micro-mechanical processes that control the adhesion and fracture of elastomeric polymers occur at two different size scales. On the size scale of the chain the failure is by breakage of Van der Waals attraction, chain pull-out or by chain scission. The viscoelastic deformation in which most of the energy is dissipated occurs at a larger size scale but is controlled by the processes that occur on the scale of a chain. The situation is, in principle, very similar to that of glassy polymers except that crack growth rate and temperature dependence of the micromechanical processes are very important. 

If contact with a rough surface is poor, whether as a result of thermodynamic or kinetic factors, voids at the interface are likely to mean that practical adhesion is low. Voids can act as stress concentrators which, especially with a brittle adhesive, lead to low energy dissipation, i/f, and low fracture energy, F. However, it must be recognised that there are circumstances where the stress concentrations resulting from interfacial voids can lead to enhanced plastic deformation of a ductile adhesive and increase fracture energy by an increase in [44]. 

The energy release rate (G) represents adherence and is attributed to a multiplicative combination of interfacial and bulk effects. The interface contributions to the overall adherence are captured by the adhesion energy (Go), which is assumed to be rate-independent and equal to the thermodynamic work of adhesion (IVa)-Additional dissipation occurring within the elastomer is contained in the bulk viscoelastic loss function 0, which is dependent on the crack growth velocity (v) and on temperature (T). The function 0 is therefore substrate surface independent, but test geometry dependent. 

The studies on adhesion are mostly concerned on predictions and measurements of adhesion forces, but this section is written from a different standpoint. The author intends to present a dynamic analysis of adhesion which has been recently published [7], with the emphasis on the mechanism of energy dissipation. When two solids are brought into contact, or inversely separated apart by applied forces, the process will never go smoothly enough—the surfaces will always jump into and out of contact, no matter how slowly the forces are applied. We will show later that this is originated from the inherent mechanical instability of the system in which two solid bodies of certain stiffness interact through a distance dependent on potential energy. 

The friction from the repulsive pinning center is of particular interest because it is contrary to the common belief that friction must result from attractive interactions between sliding surfaces. The results presented in Fig. 17(a) demonstrate that friction can be created by purely repulsive interactions. What really matters is the instability of the sliding body and energy dissipation, rather than the attractive or repulsive nature of interactions. This may also shed a light on the efforts to explore the correlation between friction and adhesion. 

---