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Y-aminopropyltriethoxysilane

Rhodamine B 67 is frequently used in the quantitative determination of DNA or RNA and fluorescent labeling for DNA [190-192]. This dye was assembled onto the surface of a quartz substrate by electrostatic interaction between the fluorescence reagent RB and y-aminopropyltriethoxysilane (APES), and the Quartz/ APES/RB film was constructed (Fig. 1) [193]. [Pg.52]

Graftcopolymerization onto silicone rubber is rather difficult to achieve and is often accompanied by unwanted changes in physico-mechanical properties of the polymer caused by initiating agents. To overcome the problem, silica was introduced into the rubber matrix as an active filler capable of binding cationic compounds such a cationic compound being y-aminopropyltriethoxysilane. Schematically the pathway for heparinization of the latter may be presented as follows ... [Pg.108]

Quite significant is the fact that the amount of platelets adhered depends on the synthesis procedure for HCP. For example, the platelet adhesion onto silicone rubbers heparinized via the TDMAC procedure was 150000 platelets/cm2, while the very same rubbers that were heparinized via y-aminopropyltriethoxysilane adhered only 90000 platelets/cm2 88). The platelets are to a greater extent adhered by the polymers containing covalently immobilized heparin than by those that elute heparin into the bloodstream n3) although the immobilized heparin itself does not interact with the platelets 21 . [Pg.117]

Characterization of films of organofunctional silanes by TOFSIMS and XPS. Part I. Films of A/-(2-(vinylbenzylamino)-ethyl]-3-aminopropyltri-methoxysilane on zinc and y-aminopropyltriethoxysilane on steel substrates... [Pg.323]

A freshly opened batch of y-aminopropyltriethoxysilane (A-1100, supplied by Union Carbide) was used in this treatment. It is reported to be 99% pure. [Pg.346]

Financial assistance from SERC and GKN pic is gratefully acknowledged. We thank Professor D. Briggs and Dr. M. Hearn (ICI pic) for valuable assistance. We also thank Union Carbide Ltd for supply of y-aminopropyltriethoxysilane (A-1100). [Pg.364]

Silanes, y-aminopropyltriethoxysilane and methyltrimethoxysilane were obtained from Union Carbide (A1100 and A163 silanes, respectively), y-chloro-propyltrimethoxysilane was obtained from Petrarch Systems, Inc. [Pg.381]

Figure 2. Monolayer adsorption isotherms on E glass fiber at 30°C. Substrate treatments are water size (solid lines) y-aminopropyltriethoxysilane (closely spaced dots) methyltrimethoxysilane (dashes) and y-chloropropyltrimethoxysilane (widely spaced dots). Figure 2. Monolayer adsorption isotherms on E glass fiber at 30°C. Substrate treatments are water size (solid lines) y-aminopropyltriethoxysilane (closely spaced dots) methyltrimethoxysilane (dashes) and y-chloropropyltrimethoxysilane (widely spaced dots).
Figure 5. Thermal desorpiion polytherms for i-butylamine from E glass fiber treated with (A) y-aminopropyltriethoxysilane (B) methyltrimethoxysilane and (C) y-chloropropyltrimethoxysilane. Polytherms are shown with desorption of adventitiously adsorbed organic material subtracted out. Figure 5. Thermal desorpiion polytherms for i-butylamine from E glass fiber treated with (A) y-aminopropyltriethoxysilane (B) methyltrimethoxysilane and (C) y-chloropropyltrimethoxysilane. Polytherms are shown with desorption of adventitiously adsorbed organic material subtracted out.
Abstract—The effects of both y-aminopropyltriethoxysilane (APS) and elevated temperature and humidity (T H) exposure on the adhesion of pyromellitic dianhydride-oxydianiline polyimide to SiO , AkOi, and MgO were studied using XPS, SEM, and peel test. Adhesion and T H stability of PMDA-ODA on Si02 is significantly improved when APS is used at the interface, while no significant improvement is observed for AkO, or MgO. XPS analysis of the surfaces showed no retention of APS on AkO, or MgO, while Si02 did retain APS, as is expected. The APS retention is affected by surface treatment of the oxide prior to APS application. [Pg.411]

Adhesion of polyimides to inorganic substrates is of great importance to the microelectronics industry [1, 2]. The polyimide films are deposited most often by spin coating the polyamic acid (PAA) usually from a TV-methylpyrrolidone (NMP) solution onto the substrate surface followed by thermal imidization at temperatures up to 400<>C. The most studied polyimide is the pyromellitic dianhydride-oxydianiline (PMDA-ODA), which exhibits excellent mechanical and dielectric properties, but not so good adhesion characteristics. The latter has been generally overcome by application of an adhesion promoter, such as y-aminopropyltriethoxysilane [3-7]. The reactions of APS (coated from water solution) with the silicon dioxide surface as well as with polyamic acid have been well characterized by Linde and Gleason [4] however, we do not have such detailed information available on APS interaction with other ceramic surfaces. [Pg.411]

Abstract—This work studies the effects of self-oligomerization of the aminosilane coupling agent 3-aminopropyltriethoxysilane—also called y-aminopropyltriethoxysilane. 3-APS, y-APS, APS or AUOO (Union Carbide)—on the adhesion of thin polyimide films to a native-oxide silica surface under no stress, i.e. T(0) conditions, and after standard 85°C/8I%T H (temperature and humidity) stress. Techniques have been developed using both silicon and hydrogen NMR to control and monitor the degree of oligomerization in aqueous solutions at low concentrations (0.1 vol %). [Pg.423]

Adhesion has been achieved on these oxides through a variety of silane precoat treatment processes. Solutions of y-aminopropyltriethoxysilane, y-methacryloxytrimethoxysilane, and y-glycidoxytrimethoxysilane applied to thermal oxide substrates all improved resist image adhesion for conventioanl positive photoresists Mallinckrodt Multisurf also works well. Conventional liquid-phase application of HMDS, however, was not adequate for the latter three tougher substrates listed above it did provide adequate photoresist adhesion for thermal oxides, however. For the last three substrates, a double... [Pg.453]

The vacuum distillation of y-aminopropyltriethoxysilane is carried out in tank 7, which is a steel apparatus with a coil and a jacket welded to the bottom. The coil and jacket are fed with vapour, and refluxer 8, with water for cooling. A residual pressure of 80-105 GPa is created in the system and the tank is vacuum-filled with raw y-aminopropyltriethoxysilane from collector 6. When there is reflux in the run-down box after the refluxer, fraction I pre-distillate) is separated into collector 9. The distillation continues till the temperature in tank 7 is 135 °C after that the tank is cooled to 90-100 °C and a residual pressure of 3-10 GPa is created in the system. At the given residual pressure and tank temperature not higher than 180 °C, fraction II (raw y-aminopropyltriethoxysilane) can be separated into collector 10. After the separation of fraction II, the tank is cooled down to 30-40 °C and the tank residue is poured into containers. [Pg.132]

Technical y-aminopropyltriethoxysilane should meet the following requirements ... [Pg.134]


See other pages where Y-aminopropyltriethoxysilane is mentioned: [Pg.287]    [Pg.468]    [Pg.110]    [Pg.24]    [Pg.217]    [Pg.230]    [Pg.241]    [Pg.241]    [Pg.245]    [Pg.261]    [Pg.264]    [Pg.323]    [Pg.345]    [Pg.345]    [Pg.364]    [Pg.379]    [Pg.383]    [Pg.383]    [Pg.384]    [Pg.102]    [Pg.54]    [Pg.309]    [Pg.129]    [Pg.130]    [Pg.130]    [Pg.132]    [Pg.134]    [Pg.236]    [Pg.466]    [Pg.281]    [Pg.701]    [Pg.368]    [Pg.471]    [Pg.833]   
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See also in sourсe #XX -- [ Pg.82 , Pg.130 ]

See also in sourсe #XX -- [ Pg.91 , Pg.91 , Pg.154 , Pg.156 , Pg.368 ]




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Aminopropyltriethoxysilane

Y-Aminopropyltriethoxysilane APTS)

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