Wafered silicon technology

ScHWESiNGER, N., Marueke, O., Qiao, F., Devant, R., Wurziger, H., A full wafer silicon microreactor for combinatorial chemistry, in Ehreeld, W., Rinard, I. H., Wegeng, R. S. (Eds.), Process Miniaturization 2nd International Conference on Microreaction Technology, IMRET 2, Topical Conf. Preprints, pp. 124-126, AIChE,... 

To appreciate the rapid development of process technology, the progression of the IC industry must be considered first. (For summaries of the historical development of this field, see references 1 and 2.) A central theme in the IC industry is the simultaneous fabrication of hundreds of monolithic ICs (or chips) on a wafer (or slice) of silicon (or other material such as gallium arsenide), which is typically 100-150 mm in diameter and 0.75 mm thick. In silicon technology, chip areas generally range from a few square millimeters to over 100 mm2. A large number (often more than 100) of individual process steps, which are precisely controlled and carefully sequenced, are required for the fabrication. 

Hybride micro-FIA systems produced in silicon technology using oxygen microelectrodes and microcavities have been developed for measuring phosphate concentrations [96]. Multiple analyte biosensor arrays can also be realized using thin film and silicon technology. The so-called containment technology has been applied to immobilize enzymes in three dimensional cavities formed in silicon wafers to get fully process compatible biosensor devices [97] (Fig. 5). 

Busnaina A, Park J, Bakhtari K. Particle deposition and adhesion. In Reinhardt K, Kem W, editors. Handbook of Silicon Wafer Cleaning Technology. 2nd ed. Norwich, NY William Andrew Publishing 2006. 

W. Kern, The evolution of silicon wafer cleaning technology, J. Electrochem. Soc. 137, 1887, 1990. 

Silicon wafer process technology Slicing, etching, polishing, in Semiconductor Silicon 1977, H. R. Huff and E. Sirtl (eds.), p. 154, Electrochemical Society, Pennington, 1977. 

J. Haisma, G. A. C. M. Spierings, U. K. P. Biermann, and J. A. Pals, Silicon-on-insulator wafer honding-wafer thinning technological evaluations, Jpn. J. Appl. Phys. 1426, 1989. 

To understand the potential of the different photovoltaic silicon ribbon technologies, a closer look at the wafer growth technology, wafer characteristics and behaviour in the cell process are all necessary. 

Iyer SS, Auberton-Herve AJ (eds) (2002) Silicon wafer bonding technology for VLSI and MEMS applications. INSEPCT. The lEE, London... 

R. Devant, H. Wurzinger, A full wafer silicon microreactor for combinatorial chemistry, in Process Miniaturization 2nd International Conference on Microreaction Technology - IMRET 2,1998. 

---