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Underfill adhesives properties

In the application of capillary-flow underfills, there are so many material, process, and equipment variables that empirical methods are widely used to establish the optimum processing conditions. The viscosity and flow properties of underfill adhesives are among the most important variables in rapidly filling different gap sizes and devices. A list of some commercially available underfill adhesives and their flow properties, as related to filler size and gap height, is given in Table 5.3. [Pg.225]

Table 5.3 Flow Properties of some underfill adhesives... [Pg.232]

The use of underfill adhesives has resulted in the development of the draft version of J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages. The guideline covers critical material properties for underfill materials to assure compatibility in underfill applications for reliable electronic assemblies as well as selected process-related qualification tests such as thermal cycling. Table 6.9 summarizes selected materials requirements for underfill adhesives from the proposed JEDEC J-STD-030. ... [Pg.336]

Table 5.3. Flow Properties of Some Underfill Adhesives... Table 5.3. Flow Properties of Some Underfill Adhesives...
Properties of nanofillers recently developed nano materials are reported to display greater mechanical strength, greater thermal conductivity and improved electrical performance when compared to materials of normal particle sizes. Nano dimensional materials are being studied as fillers in polymer matrices in a variety of formulations for electrically conductive adhesives, thermally conductive adhesives, encapsulants, printed circuit boards, coatings, catalysts, underfills for flip-chip-attached devices and wafer-level connections. ... [Pg.110]

Once cured, the properties of NFUs are similar to those of capillary-flow underfills. One major difference is that the no-flow materials are generally unfilled and, as a result, their expansion coefficients are higher than those of their filled counterparts. However, their lower moduli more than compensate for the mismatches in expansion coefficients. NFU adhesives have shorter shelf lives than capillary-flow types because of the incorporation of the fluxing agent into the adhesive formulation. Table 5.4 is a compilation of underfills and their properties while Table 5.5 lists examples of capillary flow and no-flow underfills and their applications. [Pg.233]


See other pages where Underfill adhesives properties is mentioned: [Pg.11]    [Pg.71]    [Pg.129]    [Pg.234]    [Pg.408]    [Pg.90]    [Pg.286]    [Pg.90]    [Pg.288]    [Pg.407]    [Pg.53]    [Pg.194]    [Pg.183]    [Pg.154]    [Pg.239]    [Pg.154]   
See also in sourсe #XX -- [ Pg.5 , Pg.232 , Pg.234 ]




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