Ultem 1000® adhesive

Samples of unfilled resins (ULTEM 1000) were utilized to examine the changes occurring to the plastic during the chemical treatments. Adhesion data was generated using the glass-filled resin (ULTEM 2312). 

Table IV. Adhesion Promoting Agents for Polyetherimide (ULTEM 2312)...

Peel strength was also affected by the heat treatment steps between metal deposition. The effect on adhesion of the bake time after electrolytic copper deposition is shown in Figure 11. Peel strength as high as 250 g/mm were observed on copper plated ULTEM 2312 with extended heatings at 110°C. Without a heat treatment, peel strength values were 50 g/mm. 

Figure 12 represents a cross section of a plated sample of ULTEM 1000 having a peel strength of 118 g/mm. Little physical surface change of the plastic has occurred as a result of the pretreatment steps. Figure 13 is a cross section of copper plated ULTEM 2312. While a mechanical component to adhesion is present, it is much less than that found in traditional swell and etch treatment (Figure 2). Physical alteration of the plastic is confined to the outermost 25ii. The bulk properties of the plastic (flexural strength, electrical resistivity) are unaffected by this new process (Table I).

They are easily bonded with epoxy or urethane adhesives however, the temperature resistance of the adhesives do not match the temperature resistance of the plastic part. No special surface treatment is required other than abrasion and solvent cleaning. Polyetherimide (ULTEM ), polyamide-imide (TORLON ), and polyethersulfone can be solvent cemented, and ultrasonic welding is possible. 

Ultem 1000 26 (Fig. 13) marketed by General Electric is a poly(ether-imide) representative of a series of thermoplastic polyimides that can be used as adhesives or moulding materials for applications at moderate temperatures T = 220°C). 

AF 131, based on epoxy-phenolic resins, provides Al/Al bonds with lap shear strengths of 25.5, 20 and 10.3 MPa at 180, 200 and 260°C, respectively. Solventless epoxy and epoxy-phenolic adhesives provide bond lines with a low level of porosity. This is also the case with poly(ether-imide) Ultem 1000 and poly(imide-siloxanes), which are generally processed at temperatures 50-100°C above their Tg. In contrast, high porosity is observed with most condensation... 

Thermoplastic poly(ether-imide) Ultem 1000 (Tg 217°C) is used as overlay adhesive for a Kapton film on which the interconnect is created [92]. This adhesive layer is disclosed to produce void-free lamination at approximately 300°C. Actual dielectric layers therefore consists of 25 xm thick Kapton over 12.5 xm thick adhesive film. The self-relaxation properties of Ultem 1000 tend to release... 

GE www.ge.com) patented both the synthesis of a new dianhydride with two ether-hnking units and its use to produce poly(ether-imides). The production process, chemical, mechanical, and electrical properties of Ultem 1000 (www.sabic-ip.com) have been recently reviewed. Research at Occidental Chemical (www.oxychem.com) has focused on the synthesis of 4,4 -oxybis(l,2-benzenedicarboxylic acid) dianhydride (OPDA, 103) and on the poly-imides prepared from this compound and various aromatic diamines. For the past 15 years new poly (ether-imides) have been proposed as thermoplastic materials to produce adhesives, self-standing films, and interlayer dielectrics. Chemical formulae of typical ether-linked aromatic diamines are illustrated in Fig. 12.14. 

The most important resins available for use as adhesives in high temperature structural applications are Pis and polybenzimidazoles (PBIs), both of which are described later (see Sections 5.35 and 5.33). These resins are supplied as prepolymers containing open heterocyclic rings, which are soluble and fusible. At elevated temperatures, the prepolymers undergo condensation reactions leading to ring closure and the formation of insoluble and infusible cured resins [8]. Table 5.5 provides examples of performance properties of a poly-etherimide adhesive (Ultem is trademark of SABIC Corp). IP-600 stands for Thermid IP-600 for which the chemical formula is shown in Rgure 5.1. 

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