Thinner chips

To obtain lower-fat, higher-quality chips, good deep-frying techniques are needed. An important factor is the size and shape of the chips. Thick-cut chips (larger than 12 mm in diameter) absorb less fat than thinner chips. Cracks and rough surfaces increase fat absorption. Chips may have a 6 to 20% fat content, while crisps may have a fat content as high as 35%. Other important factors in... 

Two microstructured layers of the 2x2 chip were fabricated by photolithography and wet etching in glass (Figure 4.11) [23,24]. These top and bottom layers and a third thinner layer containing holes as conduits were thermally bonded to yield the chip. The way of guiding the micro charmels, as described above, is referred to as two-level crossing. 

In the electronics indnstry, a Pentinm compnter chip has hundreds of millions of transistors and only a hundred pins in and out. If each transistor had to be addressed individually, it would be impossible to have such a chip. Microfluidic systems are similarly easy to control n fluid lines can be controlled by 21og n control hues. Additionally, the pressure to actuate a valve depends on the width of the control line, so by choosing our pressure carefully, one thinner fluid line can be closed while the wider fluid lines remain open due to insufficient pressure. This idea has been used to develop microfluidic systems that can screen enzymatic libraries and perform in vitro transcription translation of DNA to protein in approximately 30 minutes. 

It is clear that the quenched material has lamellae that are both thinner in the chain direction and smaller in lateral extent. Both these parameters increase with slower rates of cooling. So, too, does density. The microstructure of PTFE prepared this way may be likened to a pack of rods (the helical polymer chains), which in turn comprise lamellar crystals. Consider a hexagonal poker chip as a macroscopic analogue of one lamella. The diameter of die poker chip is the lamellar breadth and its thin dimension is the lamellar thickness. The fully extended chain length of a 10-million-MW PTFE macromolecule would be ca. 26 pm while our thickest observed lamellae are ca. 0.5 pm thick. It therefore... 

Electrically conductive adhesives are being used to interconnect flip-chip devices in smart cards resulting in thinner and smaller structures. Flip-chip silicon devices that have been thinned to several mils may be connected to a substrate with silver-filled paste epoxy or with anisotropic film adhesive instead of solder, then embedded and laminated to form a card that is less than 40-mils thick. Requirements for adhesives used in smart cards, in many respects, are more severe than those for other commercial applications. Besides having to withstand high humidity and temperature extremes, smart cards must take the continued abuse of human handling, repeated bending, exposure to human sweat and salt residues, and exposure to ultraviolet radiation from sunlight. 

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