Thick film technology spray deposition

The microstructure was realized by a dry-film photoresist technique and based on established techniques from printed circuit board technology [142], Dry resists are available as thin films, e.g. of thickness 50 or 100 pm. The resist films are encased in other polymer materials which are later removed. The resist films can be deposited on various base materials such as silicon or polymers giving mechanical stability. Lamination is carried out with a roller laminator. Then, exposure is made and spray development without any solvents follows. The process steps can be repeated at multi-laminated structures. Closed structures can be made in this way. 

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