Thick-film multilayer structures paste

Thick-film circuits are single or multilayer structures produced by depositing a layer, or layers, of a specially formulated paste or ink onto a suitable substrate. Thick-film technology began in the early 1960s when DuPont introduced a thick-film resistor system for application in miniaturized circuits. IBM used thick-film materials in then-family of IBM/360 computers. Currently the worldwide market for thick-film circuits and devices is around 14 billion. Most thick-film circuits are still used in electronic applications such as in computers (Figure 27.14). 

Capacitor dielectrics for ceramic circuits are available as tapes and pastes. The latter are used for plate capacitors on both the surface (e.g., standard thick-film technology) and within a multilayer structure. Electrodes are made... 

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