Thermal expansion coefficient transitions

The Rheometric Scientific RDA II dynamic analy2er is designed for characteri2ation of polymer melts and soHds in the form of rectangular bars. It makes computer-controUed measurements of dynamic shear viscosity, elastic modulus, loss modulus, tan 5, and linear thermal expansion coefficient over a temperature range of ambient to 600°C (—150°C optional) at frequencies 10 -500 rad/s. It is particularly useful for the characteri2ation of materials that experience considerable changes in properties because of thermal transitions or chemical reactions. 

Cordierite [12182-53-5] Mg Al Si O g, is a ceramic made from talc (25%), kaolin (65%), and Al O (10%). It has the lowest thermal expansion coefficient of any commercial ceramic and thus tremendous thermal shock resistance. It has traditionally been used for kiln furniture and mote recently for automotive exhaust catalyst substrates. In the latter, the cordierite taw materials ate mixed as a wet paste, extmded into the honeycomb shape, then dried and fired. The finished part is coated with transition-metal catalysts in a separate process. 

Cathodoluminescence microscopy and spectroscopy techniques are powerful tools for analyzing the spatial uniformity of stresses in mismatched heterostructures, such as GaAs/Si and GaAs/InP. The stresses in such systems are due to the difference in thermal expansion coefficients between the epitaxial layer and the substrate. The presence of stress in the epitaxial layer leads to the modification of the band structure, and thus affects its electronic properties it also can cause the migration of dislocations, which may lead to the degradation of optoelectronic devices based on such mismatched heterostructures. This application employs low-temperature (preferably liquid-helium) CL microscopy and spectroscopy in conjunction with the known behavior of the optical transitions in the presence of stress to analyze the spatial uniformity of stress in GaAs epitaxial layers. This analysis can reveal,... 

The value of the change in thermal expansion coefficient accompanying the transition is considerably larger than that obtained when the transition is thermally induced at atmospheric pressure. The present value for the thermal expansion at 22 °C and atmospheric pressure is 3.0 x 10 °C and for tem-... 

Specific gravity Average thermal expansion > coefficient J Transition point Softening point Maximum service temperature Bending... 

An additional check is the almost coincidence of the linear thermal expansion coefficients of the composite in the glassy region. Theory yields acl = 48.20 x 10-6 °C whereas experiment gives ac, = 48.00x 10 6 °C 1. This coincidence does not hold beyond glass transition. Indeed it was found that ot = 122.90 x 10-6 °C, whereas the experiment gave a 2 = 158 x 10"6 °C 1. 

As a consequence, the overall penetrant uptake cannot be used to get direct informations on the degree of plasticization, due to the multiplicity of the polymer-diluent interactions. The same amount of sorbed water may differently depress the glass transition temperature of systems having different thermal expansion coefficients, hydrogen bond capacity or characterized by a nodular structure that can be easily crazed in presence of sorbed water. The sorption modes, the models used to describe them and the mechanisms of plasticization are presented in the following discussion. 

The glass transition temperature of a dilute system, according to the free volume changes, is determined by the diluent volume fraction Vd, and changes of the thermal expansion coefficient, a, at Tg by using ... 

Network properties and microscopic structures of various epoxy resins cross-linked by phenolic novolacs were investigated by Suzuki et al.97 Positron annihilation spectroscopy (PAS) was utilized to characterize intermolecular spacing of networks and the results were compared to bulk polymer properties. The lifetimes (t3) and intensities (/3) of the active species (positronium ions) correspond to volume and number of holes which constitute the free volume in the network. Networks cured with flexible epoxies had more holes throughout the temperature range, and the space increased with temperature increases. Glass transition temperatures and thermal expansion coefficients (a) were calculated from plots of t3 versus temperature. The Tgs and thermal expansion coefficients obtained from PAS were lower titan those obtained from thermomechanical analysis. These differences were attributed to micro-Brownian motions determined by PAS versus macroscopic polymer properties determined by thermomechanical analysis. 

Since the glass transition corresponds to a constant value of the relaxation time [15], dTjdP is just the pressure coefficient of Tg. Comparing Equations 24.10 and 24.13, we see that the scaling exponent is related to quantities—thermal pressure coefficient, thermal expansion coefficient, Tg, and its pressure coefficient—that can all be determined from PVT measurements... 

The thermal expansion coefficients of PVCL and a copolymer in water, tfpol> were determined by PPC as a function of temperature (Fig. 23) [180]. The plots can be divided into four temperature ranges. Below the transition temperature, 10 < T < 30 °C, g i for PVCL remains constant, while in the case of PVCL-g-34, apoi has a negative slope. In both cases, apoi undergoes a sharp... 

The fluorine content, density, critical surface energy, glass transitions, thermal expansion coefficient above and below the glass transition, and 300°C isothermal thermogravimetric stabilities of the fluoromethylene cyanate ester resin system with n = 3, 4, 6, 8, 10 are summarized Table 2.2. Also included for the purpose of comparison are the corresponding data for the aromatic cyanate ester resin based on the dicyanate of 6F bisphenol A (AroCy F, Ciba Geigy). 

The thermal expansion, however, changes behavior at the glass transition, which is a phenomenon that was first analyzed in detail in a careful study by Kovacs.4 In the polymer melt, the thermal expansion coefficient is almost constant, and it is again so in the glass but with a smaller value. At the glass transition, there is therefore a break in the dependence of density on temperature that is the foremost thermophysical characteristic of the glass transition. 

Composite-based PTC thermistors are potentially more economical. These devices are based on a combination of a conductor in a semicrystalline polymer—for example, carbon black in polyethylene. Other fillers include copper, iron, and silver. Important filler parameters in addition to conductivity include particle size, distribution, morphology, surface energy, oxidation state, and thermal expansion coefficient. Important polymer matrix characteristics in addition to conductivity include the glass transition temperature, Tg, and thermal expansion coefficient. Interfacial effects are extremely important in these materials and can influence the ultimate electrical properties of the composite. 

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