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Thermal expansion coefficient stability

The term PDC is defined as polycrystalline diamond compact. The term TSP is defined as thermally stable polycrystalline diamond. TSP materials are composed of manufactured polycrystalline diamond which has the thermal stability of natural diamond. This is accomplished through the removal of trace impurities and in some cases the filling of lattice structure pore spaces with a material of compatible thermal expansion coefficient. [Pg.803]

However, since measurements of Tg s and the thermal expansion coefficients are not very sensitive and accurate, the results derived from such model present some scattering and their reliability needs further proof for its validity. Therefore, in the following we shall concentrate to the unfolding models for fiber composites, as they have been extended from the respective models for particulates, which present significant stability and unquestionned reliability. [Pg.176]

In this chapter the technological development in cathode materials, particularly the advances being made in the material s composition, fabrication, microstructure optimization, electrocatalytic activity, and stability of perovskite-based cathodes will be reviewed. The emphasis will be on the defect structure, conductivity, thermal expansion coefficient, and electrocatalytic activity of the extensively studied man-ganite-, cobaltite-, and ferrite-based perovskites. Alterative mixed ionic and electronic conducting perovskite-related oxides are discussed in relation to their potential application as cathodes for ITSOFCs. The interfacial reaction and compatibility of the perovskite-based cathode materials with electrolyte and metallic interconnect is also examined. Finally the degradation and performance stability of cathodes under SOFC operating conditions are described. [Pg.132]

The fluorine content, density, critical surface energy, glass transitions, thermal expansion coefficient above and below the glass transition, and 300°C isothermal thermogravimetric stabilities of the fluoromethylene cyanate ester resin system with n = 3, 4, 6, 8, 10 are summarized Table 2.2. Also included for the purpose of comparison are the corresponding data for the aromatic cyanate ester resin based on the dicyanate of 6F bisphenol A (AroCy F, Ciba Geigy). [Pg.32]

Thermal Properties. Many commercial glass-ceramics have capitalized on their superior thermal properties, particularly low or zero thermal expansion coupled with high thermal stability and thermal shock resistance properties that are not readily achievable in glasses or ceramics. Linear thermal expansion coefficients ranging from —60 to 200 x 10-7 j° C can be obtained. Near-zero expansion materials are used in applications such as telescope mirror blanks, cookware, and stove cooktops, while high expansion frits are used for sealing metals. [Pg.320]

While physicochemical and spectroscopic techniques elucidate valuable physical and structural information, thermal analysis techniques offer an additional approach to characterize NOM with respect to thermal stability, thermal transitions, and even interactions with solvents. Information such as thermal degradation temperature (or peak temperature), glass transition temperature, heat capacity, thermal expansion coefficient, and enthalpy can be readily obtained from thermal analysis these properties, when correlated with structural information, may serve to provide additional insights into NOM s environmental reactivity. [Pg.785]

We choose to grow BDD coatings on ceramic substrate, more precisely on silicon. The substrate for BDD electrodes must satisfy some criteria inherent to the preparation condition of BDD coatings itself (Haenni et al. 2004). Main ones are a chemical and mechanical stability at the preparation conditions of diamond coatings (1,000°C in H2 atmosphere) and an adequate thermal expansion coefficient. Of course silicon satisfies these points and regarding the second one, it is even a material which has one of the closest coefficient as that of BDD 0-3.5 x 10-6K-1 compared to... [Pg.144]


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See also in sourсe #XX -- [ Pg.61 , Pg.231 , Pg.268 ]




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