Thermal Degradation Mechanism of the Cured Epo-S Network

Stevens, Epoxy Resin Technology, Wiley-Interscience New York, 1968. 

Crivello and U. Varlemann, Journal of Polymer Science, Part A Polymer Chemistry, Vol. 33, p. 2463, 1995. 

Prince, and W. Nakayama, Electronic Packaging Design, Materials, Process, and Reliability, McGraw-Hill New York, 1998. 

Mendoza, A. Capuz, J. Caguiat, H. Sy, and R. Lathrop, 10th Electronics Packaging Technology Conference, Singapore, p. 1258,2008. 

Tesoro and V. R. Sastri, Journal of Applied Polymer Science, Vol. 1425,1990. 

---