Textile and Fiber Coating

CP - in this case, the Versicon P(ANi), incorporating sulfonate dopants, is stable above the melt processing temperatures used. 

Among P(3AT)/thermoplastic blends, P(3-0ctyl-T)(P(30T))/PEVA has been the most studied [127, 277] the percolation threshold for appreciable (ca. 0.1 S/cm) conductivities for this have been as low as 20 w/w% P(30T) [127]. Laakso et al. [127] described a detailed procedure for melt processing of P(30T), having a m.p. of 160°C, with thermoplastics such as PEVA, PE and PStyr, using a conunercial melt blender. Doping of the blends Could then be carried out with iodine vapor, or in nitromethane solution with FeCls. In spite of much promising work, however, actual commercial applications of such thermoplastic blends have still not appeared to date. 

In more recent work, a composition which was claimed to be fusible and melt-extrudable was developed in a joint effort of UNIAX Corp., Santa Barbara, CA, USA, and Neste Oy, Porvoo, Finland, given the tradename PANIPOL [278]. In its typical preparation, a sulfonated P(ANi) salt, a plasticizer, and other optional additives are fed into a twin-screw extruder with a typical temperature profile along the screw of between 100 and 180 °C and residence time 5 to 10 mins. The resulting conductive strands are cooled, pelletized and packaged. The conductive pellets are then compounded for such end uses as injection molded articles or extruded films and fibers, or any other conductive thermoplastic products. The authors also claimed to have demonstrated conductive thermosets based on solution-processed PANIPOL. 

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