Temperature scales historical developments

The use of adhesives can be traced back many centuries, while the production of adhesives, on an industrial scale, started about 300 years ago. The birth of modern structural adhesives can be dated from about 1910, with the introduction of the phenol-formaldehyde resins.Table II summarizes the historical development of structural adhesives, with the dates referring to the approximate time period during which each adhesive became commercially available. The introduction dates for the high-temperature polymers (polyimide, polybenzimidazole, and polyquinoxa-line) have been included for reference, although, as previously mentioned, there are presently few commercial products based on these polymers. 

Section 14.2 presents a description of the TDL technique for temperature measurement, including the theory and basic principles behind the method. Section 14.3 provides a historical overview of the development of this technique to provide a sense of the considerable amount of research that has been performed in this field to date. Section 14.4 provides details of four TDL-based systems capable of temperature measurement in full-scale environments that are thought to be of particular interest to the industrial combustion community. Finally, Section 14.5 contains some concluding remarks about the current state of TDL sensors and possible outcomes of future developments. 

The set of primary and secondary factors which influence LAD design were formulated, and a suite of physics-based models for the influential factors were developed and validated both in storable and cryogenic propellants. While the models agreed well with historical room temperature data, all LAD models validated by cryogenic data, including bubble point pressure, reseal pressure, FTS pressure drop, TVS cooling efficiency, and full-scale LAD channel pressure drop show strong temperature dependence and deviation from the room temperature behavior. The models derived here and validated both by the... 

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