Summary on the Organic Particles

FIGURE 7.23 The overall average overburden copper thickness and step height of 100 pm copper in the 50 % metal density region on a SEMATECH 854 patterned wafer (from Ref. 109). 

What are the main reasons for the difference in each case  

How will you design a slurry for a noble metal List all the items you would take into consideration. 

What steps would you take to design CMP slurry for low-k applications  

What are some of the key variables impacting the WIWNU of a CMP process  

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