Summary of Wafer Level 3D Approaches

5 Summary of Wafer Level 3D Approaches Table 15.1 presents the perceived pros and cons of the 3D approaches discussed in this chapter, with respect to various characteristics offered by 3D integration. If an aspect is viewed as challenging, then it is currently limiting some application of 3D or requires significant process modification to address a rating of good implies 

FIGURE 15.8 Schematic representation of the redistribution layer bonding approach to 3D integration demonstrated by McMahon et al. (from Ref. 51). 

Comparison of Features of Four Approaches to Wafer-level 3D 

Bond strength Good Good Best Good 

Bond temperature Challenging/best Good Best Good 

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