Structuring by Means of Masked Etching in Microsystems Technology

Structuring by Means of Masked Etching in Microsystems Technology 

The means of masking will be described together with the structuring processes for which they are used. 

To produce through-holes and cavities in a wafer, special forms of lithography are employed. If it is assumed that a roughly constant amount of material requires to be removed from all over the wafer, the creation in one and the same process of both cavities and holes is not feasible. The only chance of achieving this is to perform masking and lithography from both sides and then etch both sides simultaneously. 

The through-holes will be on both sides but the cavities only on one side. The 

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