Structured dielectrics, laminated

Laminating this structure against a substrate that supports an organic semiconductor, gate dielectric (GR) and gate electrode (ITO) forms a transistor with the source/drain electrodes on top of the semiconductor. The transistor shown here... 

These results reveal that- a plastic foam structure may be considered as a system of thin films and, therefore, support a model of plastic foam morphology namely a matrix system composed of thin polymeric films defining two groups of cells (macro- and microcells). Additional support in favor of this model of plastic foam structure is provided by the studies on the electric properties of plastic foams Among the numerous equations so far advanced for the calculation of the dielectric properties, the expressions which describe the dry foam structure by one of the limiting cases of a matrix system, namely a laminated dielectric structure with layers parallel to the force lines of the electrical field, agree best with the experiments >. 

Epoxy/cyanate ester thermoset blend-based composites have low dielectric constant desirable for advanced radomes, microwave anteimas, and stealth aircraft composite applications. Other applications include its use in copper clad laminates, semiconductor devices, and fire-resistant aircraft structural composites. 

Cyanate esters are used in circuit boards because of their low dielectric constant of 2.91 and a high Tg of 290°C. Prepregs and laminates are made with conventional technology, and they are tougher and more moisture resistant than FR-4 copper clad. Laminates are also used in radomes, antennas, and aerospace structures. 

Type VI Constructions. Type VI describes constructions of HDI in which the electrical interconnections and wiring can be formed simultaneously. Another variety forms the electrical interconnections and the mechanical structure simultaneously. The layers may be formed sequentially or co-laminated.The conductive interconnect may be formed by means other than electroplating, such as anisotropic films/pastes, conductive pastes, dielectric piercing posts, and so on. Figure 22.4f shows this construction as illustrated in IPC-2226. 

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