STM imaging of copper

Figure 18. 3 D STM images of copper coatings electrodeposited from a) solution Cu I, thickness of the coating 8 = 20 pm,15 b) solution Cu II, 8 = 20 pm,15 c) solution Cu I, 8 = 25 pm,13 d) solution II, 8 = 25 pm.16 (Reprinted from Refs.131516 with permission from Elsevier, Springer-Verlag and Union of Engineers and Technicians for Protecting of Materials of Serbia, respectively.)...

Many of the STM images involving Ceo are obtained at low temperatures ( 5 K). It is pertinent to consider what the time-scales are for typical molecular motions at these low temperatures. Repp et al. [13] recorded STM images of copper clusters, comprising 1-3 atoms on a Cu(l 11) surface, at a variety of temperatures. The... 

Figure 9. UHV-STM image of copper-phthalocyanine molecules showing fine structure of molecules. In the image is embedded HOMO calculated molecular scheme. Reprinted with permission from Ref. 81, CopxTight (1989) American Physical Society.

Fig.7. In-situ STM images of copper potentiostatic pulse plating on gold. Electrolyte 0.001 M CUSO4 and 0.05 M H2SO4 in Millipore water, (a) Clean surface, d = 9 mn. (b) Ten pulses of 0/-100 mV, each 500 ms duration (stripes), d— 44 nm. (c)Copper crystallites created by the process, E=0 mV, Et = 42 mV, d = 29 mn. It = 4.2 nA.

Figure 10.6 STM image of copper islands on the (100) face of a copper single crystal in 0.01 mol dm HCl potential jump from 0.23 to +0.16 V the dissolution of one step is observed, while the step rectangular to this step but with the same orientation is stable. The different stabilities could be explained by a Jahn-Teller effect of the surface lattice. (Reproduced with permission from Ref. [12], 2001, Elsevier.)...

Figure 10.2 Adsorbed sulfur structures on Cu(lll). (a) Model of the (x/7 x x/7) R19° phase showing the Cu4S tetramers large grey circles are added coppers, smaller circles represent S. (b) Filtered 50 x 50 nm STM image of coexisting ( /l x y 7) R19° and complex structures, (c) 5 x 5nm STM image of domain boundary between the two phases. (Reproduced from Refs. 6 and 7).

Figure 1.10 UHV-STM images of HtB-HBC adsorption on Cu l 1 0 showing the correlation between the orientation of the adsorbate lattice vectors and the local rotation of the molecule away from its high symmetry azimuthal orientation atop a copper atom.

Fig. 24. STM image of a thick Cu overlayer on Au(100) in 0.05 M H2S04 + 1 mM CuS04 at —0.2 V vs. SCE. Clusters have been formed on top of the wavy copper phase, the latter still being clearly visible in between the clusters [78],...

FIG. 28. The formation of upd layers often involves complex interactions between the anion, upd metal, and substrate. An example is provided by the (Vs X vVs) R30° STM image of the copper/sulfate upd layer formed on Au(lll) and the SXS of the interfacial structure. (Adapted from Refs. 148, 351, 353.)... 

STM image of a tightly packed lattice of copper atoms [Joseph Stroscio Robert Celotta/NIST)... 

An STM image of individual molecules was obtained on a copper-(lll)-sur-face and shows nanometer-sized flat mandala -type squares measuring 6.5 nm (sides) and 8.3 nm (diagonals). The nickel-nickel distance between two adjacent molecules is 13-18 nm. The molar absorption coefficient lies at around... 

Figure 7. 3D STM image of the copper coating electrodeposited from a pure sulfate solution. (Reprinted from Ref.13 with permission from Elsevier.)...

It can be seen from Fig. 25 that the zinc coating obtained from solution Zn I is relativelly smooth, but without large flat and mutually parallel parts of the surface, which were characteristic of the previously observed copper surfaces (see Section 11.2(0 and Section 11.2(h). The surfaces of zinc coatings of thicknesses 20 and 60 pm were very similar to that of the zinc coating of thickness 25 pm and, consequently, the STM images of these zinc coatings are not presented. 

An STM image of nickel atoms placed on a copper surface. 

Figure 2.12 Overview of three-dimensional structures and in situ STM images of metalloproteins representative of the three ET protein classes characterized by single-crystal PFV and in situ STM to single-molecule resolution, (a) Blue copper protein P. aeruginosa azurin (PDB 4AZU) [94] ...

Figure 7-18. A sequence of in situ STM images of azurin adsorbed on Au(lll) in 50 mM NTLtAc (pH 4.6). Taken for increasing positive substrate potentials -0.05 (a), 0.0 (b), +0.05 (c) and +0.10 V (d). Potentials quoted are relative to the equilibrium redox potential of the centre. Note that the image contrast has decreased in images (c) and especially (d), which are above the equihbrium potential at the copper redox site (see the text). Reprinted from ref 57 with permission.

Fig.6. In-situ STM images of gold surfaces with figures machined into the surface by electrochemical methods, (a) Square produced by a sweep of cell potential fi om 0 to -100 mV five times in a diluted MBS (2-(N-moipholino)ethanesulfonic acid) buffer electrolyte. E = 500 mV, El = 546 mV, d = 24 nm, f = 2.5 nA. (b) Cavity in the surface produced by performing 40 copper electrodepositions and sub-sequent dissolutions with potentials between -500 mV and 500 mV.

The STM images of the copper coating electrodeposited in the presence of the brightening additives that exhibit high degree of mirror reflection which approached very nearly the ideal reflectance of copper are shown in Fig. 2.30 [87, 91, 96]. 

Fig. 2.30 The STM images of 25 pm thick the coppCT coating electrodeposited from solution 240 g dm CuSOtS H2O + 6O g dm H2SO4+ 0.124 g dm NaCl+ 1.0 g dm modified polyglycol ether (Lutron HF 1)+ 1.0 g dm" poly(ethylene glycol) M = 6000 (PEG 6000) + 1.5 mg dm 3 -mercapto propane sulfonate. Scan size (a) (880 x 880) nm, and (b) (300 x 300) nm, (c) the line section analysis from the portion of the STM surface of the copper coating shown in Fig. 2.30a. The distance between markers is 1.177 nm.and (d) the line section analysis of the flat part of surface of the copper coating shown in Fig. 2.30c (Reprinted from Ref. [91] with permission from Elsevier and Ref. [87] with kind permission from Springer)...

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