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Standard processes, bonding

Although neither Cjryi—H nor Cjikynyi—H bonds have been funchonalized in a catalytic process by iridium pincer complexes, a substanhal mechanishc understanding has been accumulated that may lead to catalyhc reachons in the near future. For this reason-and also due to the fact that some of these achvahon protocols are different from standard processes-a short discussion of the achievements to date is included at this point. [Pg.311]

The product alternatively may be written as A - D or A D, where the arrow denotes the direction of electron donation, or, where the nature of the bonding is understood, simply as A—D. This latter standard representation is entirely appropriate since the covalent bond, once formed, is indistinguishable from a standard covalent bond. The process should be considered reversible in the sense that, if the A—D bond is broken, the lone pair of electrons originally donated by D remains entirely with that entity. [Pg.1]

In the case of bonded composite parts, the standard process inspections are incomplete, in the sense that only lap-shear coupons are mandated. There is rarely any use of a peel test to ensure that the adhesive is stuck properly. In the author s opinion, based on years of observation of manufacturing and in-service experience, there ought to be because there is no other way of discontinuing the use of surface treatments that have been found to be inadequate. This issue is discussed by Hart-Smith (2003). [Pg.1134]

In practice, each CSF is a Slater determinant of molecular orbitals, which are divided into three types inactive (doubly occupied), virtual (unoccupied), and active (variable occupancy). The active orbitals are used to build up the various CSFs, and so introduce flexibility into the wave function by including configurations that can describe different situations. Approximate electronic-state wave functions are then provided by the eigenfunctions of the electronic Flamiltonian in the CSF basis. This contrasts to standard FIF theory in which only a single determinant is used, without active orbitals. The use of CSFs, gives the MCSCF wave function a structure that can be interpreted using chemical pictures of electronic configurations [229]. An interpretation in terms of valence bond sti uctures has also been developed, which is very useful for description of a chemical process (see the appendix in [230] and references cited therein). [Pg.300]

It IS often necessary to prepare ketones by processes involving carbon-carbon bond formation In such cases the standard method combines addition of a Gngnard reagent to an aldehyde with oxidation of the resulting secondary alcohol... [Pg.711]

Subsequent to processing, an inspection is made for incomplete bonding, inside dirt, and glass quaUty. In the case of windshields, rigid optical standards must be met, and these must be evaluated for the completed windshield. Extensive test requirements are described in the appropriate codes (11,12,15,18—24), and they include light stabiUty, resistance to optical distortion, humidity, boil test, abrasion resistance, and assorted impact tests. [Pg.527]

When the explosion-bonding process distorts the composite so that its flatness does not meet standard flatness specifications, it is reflattened on a press or roUer leveler (ASME SA20). However, press-flattened plates sometimes contain localized irregularities which do not exceed the specified limits but which, generally, do not occur in roU-flattened products. [Pg.148]


See other pages where Standard processes, bonding is mentioned: [Pg.111]    [Pg.956]    [Pg.987]    [Pg.485]    [Pg.195]    [Pg.148]    [Pg.111]    [Pg.385]    [Pg.239]    [Pg.435]    [Pg.230]    [Pg.88]    [Pg.111]    [Pg.976]    [Pg.224]    [Pg.956]    [Pg.987]    [Pg.317]    [Pg.230]    [Pg.70]    [Pg.317]    [Pg.6]    [Pg.1342]    [Pg.251]    [Pg.93]    [Pg.97]    [Pg.494]    [Pg.167]    [Pg.388]    [Pg.198]    [Pg.151]    [Pg.56]    [Pg.79]    [Pg.5]    [Pg.244]    [Pg.91]    [Pg.248]    [Pg.414]    [Pg.30]    [Pg.439]    [Pg.783]    [Pg.954]    [Pg.1064]   
See also in sourсe #XX -- [ Pg.88 ]




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Process standardization

Processing bonding

Standard Process

Standardized Processes

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