Stacking growth

Closely-Stacked Growth of Uniform InAs/GaAs Quantum Dots... 

In these deposition conditions a reasonable model of growth is the vertical stack growth, for which the number of atoms in each stack is a random variable distributed according to Poisson s law." The roughness factor of these films is often very high (say alO) " and increases in proportion to the thickness. 

Extended defects range from well characterized dislocations to grain boundaries, interfaces, stacking faults, etch pits, D-defects, misfit dislocations (common in epitaxial growth), blisters induced by H or He implantation etc. Microscopic studies of such defects are very difficult, and crystal growers use years of experience and trial-and-error teclmiques to avoid or control them. Some extended defects can change in unpredictable ways upon heat treatments. Others become gettering centres for transition metals, a phenomenon which can be desirable or not, but is always difficult to control. Extended defects are sometimes cleverly used. For example, the smart-cut process relies on the controlled implantation of H followed by heat treatments to create blisters. This allows a thin layer of clean material to be lifted from a bulk wafer [261. 

A number of theories have been put forth to explain the mechanism of polytype formation (30—36), such as the generation of steps by screw dislocations on single-crystal surfaces that could account for the large number of polytypes formed (30,35,36). The growth of crystals via the vapor phase is beheved to occur by surface nucleation and ledge movement by face specific reactions (37). The soHd-state transformation from one polytype to another is beheved to occur by a layer-displacement mechanism (38) caused by nucleation and expansion of stacking faults in close-packed double layers of Si and C. 

The core structure of the 1/2 [112] dislocation is shown in Fig. 4. This core is spread into two adjacent (111) plames amd the superlattice extrinsic stacking fault (SESF) is formed within the core. Such faults have, indeed, been observed earlier by electron microscopy (Hug, et al. 1986) and the recent HREM observation by Inkson amd Humphreys (1995) can be interpreted as the dissociation shown in Fig. 4. This fault represents a microtwin, two atomic layers wide, amd it may serve as a nucleus for twinning. Application of the corresponding external shear stress, indeed, led at high enough stresses to the growth of the twin in the [111] direction. 

Similarly, the (111) GaAs substrate could be used to achieve epitaxial growth of zinc blende CdSe by electrodeposition from the standard acidic aqueous solution [7]. It was shown that the large lattice mismatch between CdSe and GaAs (7.4%) is accommodated mainly by interfacial dislocations and results in the formation of a high density of twins or stacking faults in the CdSe structure. Epitaxy declined rapidly on increasing the layer thickness or when the experimental parameters were not optimal. 

Similar to PbSe, the controlled growth of lead telluride, PbTe, on (111) InP was demonstrated from aqueous, acidic solutions of Pb(II) and Cd(II) nitrate salts and tellurite, at room temperature [13]. The poor epitaxy observed, due to the presence of polycrystalline material, was attributed to the existence of a large lattice mismatch between PbTe and InP (9%) compared to the PbSe/InP system (4.4%). The characterization techniques revealed the absence of planar defects in the PbTe structure, like stacking faults or microtwins, in contrast to II-VI chalcogenides like CdSe. This was related to electronic and structural anomalies. 

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