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Snap-cured

Ability to relieve stresses Excellent adhesion to most surfaces Snap-cure types cure in seconds (160-200 °C) Directional conductivity with anisotropic forms soldering... [Pg.26]

Snap-cure adhesives for high production, rapid throughput... [Pg.28]

Galloway DP, et al. Reliability of novel die attach adhesive for snap curing, Proc. lEMT Symp. IEEE 1995. [Pg.32]

Burkhart A, Grosse M, Nguyen M. Novel snap cure die attach for in-line processing. Solid State Technol, Jun. 1995. [Pg.32]

Anderson B, Bacher B, Gomez M. Development Methodology for a High Performance Snap-cure, Flip-chip Underfill. Dexter Electronic Materials Technical Paper Mar. 1999. Gilleo K., Blumel D. The great underfill race. In Proc. Int. Microelectronics and Packaging Soc. 1998 701-706. [Pg.72]

Thermal Low cost. Uses existing equipment Long cycle times for most formulations. Incomplete cure may occur with fast cure, snap cure adhesives, depending on thermal mass... [Pg.201]

DSC has been used to establish optimum cure schedules for rapid curing (snap cure) adhesives and adhesives requiring longer cures. Results showed that the snap-cured adhesive was 98% cured in 3 min, compared with over 15 min for the conventional cured adhesive. The cure for the latter adhesive was verified by thermomechanical analysis (TMA) by measuring the Tg as a function of cure schedules where it was shown that up to 150 °C, the Tg had not yet reached a plateau after 30 min. At 165 °C, a plateau was reached in 30 min, and at 170 °C, the Tg peaked in 10 to 15 min. [Pg.209]

Loctite 3513 / snap cure wiring boards EGA (Handheld devices)... [Pg.236]

Electrically conductive, high-purity, snap-cure epoxy die attach Hysol KO no Loctite 78 57 -... [Pg.79]

Underfill adhesive (snap cure) Epoxy resins (high purity Bisphenol-A and cycloaliphatic resins) 45-60% Resin modifier 1—5% Curing agents (amine) 3-5% Filler (amorphous silica) 50-80% Loctite 3563, Ablebond 7811... [Pg.140]

Loctite 3593/ Loctite Snap-cure underfill 1 Ceramics, laminates Dispense, capillary imderfill Chip-scale packages requiring improved thermal cycling and mechanical-shock protection. [Pg.294]

FP4530/ Loctite Snap cure, fast-flow underfill 1 N/A Automated Flip-chip imderfill... [Pg.294]

FP4531/ Loctite Fast-flow underfill 1 N/A Automated dispensing (21-gauge needle) Flip-chip applications requiring snap cure. [Pg.294]

Amicon E 1216/ Emerson Cuming Snap-cure, nonanhydride chemistry, capillary-flow underfill >5 nul Ceramic, plastic, laminate Automated dispensing (21-gauge needle) FHp-Chip, CSP, and BGA... [Pg.295]

See other pages where Snap-cured is mentioned: [Pg.829]    [Pg.180]    [Pg.187]    [Pg.5]    [Pg.28]    [Pg.123]    [Pg.129]    [Pg.183]    [Pg.183]    [Pg.194]    [Pg.201]    [Pg.219]    [Pg.857]    [Pg.5]    [Pg.28]    [Pg.31]    [Pg.32]    [Pg.145]    [Pg.154]    [Pg.222]    [Pg.239]    [Pg.248]    [Pg.262]    [Pg.829]    [Pg.2509]    [Pg.2509]    [Pg.8503]    [Pg.8536]    [Pg.6]    [Pg.29]   
See also in sourсe #XX -- [ Pg.5 , Pg.252 ]



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