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Signal routing

De Cesare, D., Fimia, G. and Sassone-Corsi, P. Signaling routes to CREM and CREB plasticity in transcriptional activation. Trends Biochem Sci. 7 281-285,1999. [Pg.470]

In this case, the lightwave devices could be stacked in different layers resulting in an appreciable decrease in the overall device area. Also, the signal routing in three-dimensions avoids the problem of waveguide... [Pg.281]

In the inherited syndrome of chronic granulomatous disease (CGD), cytochrome Z 245 is absent and consequently the respiratory burst cannot take place [6], Persistent, but selective, bacterial infections are seen in these patients. NADPH oxidase is useful as part of a controlled acute inflammatory response to bacterial invasion, but excessive activity of this enzyme might lead to tissue destruction. In addition to PMN s, other inflammatory cell types, e.g. lymphocytes and macrophages, possess a membrane NADPH oxidase [7], ROI production by these latter cell types may form part of an intercellular communication pathway important in the inflammatory response [8], and perhaps an absence of this cell signalling route in CGD patients is linked to the development of chronic granulomata in these patients. Interestingly, myeloperoxidase deficiency is not associated with disease. [Pg.362]

Ten years after the initial identification of the tirl-1 mutant, its central role in the auxin signaling pathway has been revealed and with this the identification of a novel class of intracellular receptors. However, several early auxin responses occur too rapidly after auxin treatment to be caused by transcriptional changes and de novo protein synthesis. This, together with the fact that tirl/afbl—3 higher order mutants still seem to possess auxin responses,163 points to further auxin signaling routes waiting to be discovered. [Pg.24]

Fig. 3.2 Ras is associated with the membrane arxl receives signals from RTKs through the intervention of adaptors, such as She, which bnng Ras under the control of GDRexchange factors and GAPs. The consequence is the formation of the active GTP-bound form of Ras. Ras in the GTP 3ound form recruits Raf kinase, a senne/threonine kinase, to the membrane. The activated Raf kinase tnggers the MAP kinase, (mitogeivactivated protein kinase), phosphorylation cascade. But Ras can also control other signalling routes. For example, when Gib2 couples to dynamin, a large,... Fig. 3.2 Ras is associated with the membrane arxl receives signals from RTKs through the intervention of adaptors, such as She, which bnng Ras under the control of GDRexchange factors and GAPs. The consequence is the formation of the active GTP-bound form of Ras. Ras in the GTP 3ound form recruits Raf kinase, a senne/threonine kinase, to the membrane. The activated Raf kinase tnggers the MAP kinase, (mitogeivactivated protein kinase), phosphorylation cascade. But Ras can also control other signalling routes. For example, when Gib2 couples to dynamin, a large,...
Another common signalling route is the phosphaddylinositol 3-kinase pathway. Class I Ptdins 3-kinases, PI 3-kinases, are heterodimers, consisting of a catalytic and a regulatory subunit. Regulatory subunits of the Class Ia Ptdins 3-kinases (the p85 subunits) serve as adaptors and bind cytosolic tyrosine kinases throu their SH2 and SH3 domains (Table 4.1). [Pg.59]

Figure 3.8. Quadrature phase sensitive detection along with the phase cycling and signal routing used in CYCLOPS for eliminating quadrature artefacts. Figure 3.8. Quadrature phase sensitive detection along with the phase cycling and signal routing used in CYCLOPS for eliminating quadrature artefacts.
Figure 4.7. A schematic implementation of the ERETIC method (a) the rf signal routing and (b) the ERETIC pulse sequence. Figure 4.7. A schematic implementation of the ERETIC method (a) the rf signal routing and (b) the ERETIC pulse sequence.
Logic and Bit Operations b-l Lookup Tables b-l Math Operations Model Verification y Model-Wide Utilities b-l Ports Subsystems b-l Signal Attributes b-l Signal Routing Sinks s Sources... [Pg.150]

Model-wide utilities Ports and subsystems Signal attributes Signal routing Sinks Sources... [Pg.151]

Figures 27.17 to 27.19 show a comparison of the HDI build-ups for Types I, II, and III. In each case, complexity is added by building add-on layers sequentially.The build-up layers are typically for signal routing and contain low copper weight. Dielectric-coated (nonreinforced) microfoils (as thin as 9 to 12 pm) are employed to provide a low-profile thickness after copper plating.This is needed to facilitate the image of fine-hne widths typically associated with HDI.These styles of circuits offer some economy through use of a variety of dielectrics. The use and style of construction type must be matched with the product s expected application environment and operating life. Often the need for CTE match of area array components compels the application of a non-woven aramid layer at the surface. The resin system selection should be based on the expected CTE mismatch concerns, such as when a ceramic device is surface-mounted to the assembly. Thermal cycling of power on and off can cause earlier failure when a large mismatch is present. Figures 27.17 to 27.19 show a comparison of the HDI build-ups for Types I, II, and III. In each case, complexity is added by building add-on layers sequentially.The build-up layers are typically for signal routing and contain low copper weight. Dielectric-coated (nonreinforced) microfoils (as thin as 9 to 12 pm) are employed to provide a low-profile thickness after copper plating.This is needed to facilitate the image of fine-hne widths typically associated with HDI.These styles of circuits offer some economy through use of a variety of dielectrics. The use and style of construction type must be matched with the product s expected application environment and operating life. Often the need for CTE match of area array components compels the application of a non-woven aramid layer at the surface. The resin system selection should be based on the expected CTE mismatch concerns, such as when a ceramic device is surface-mounted to the assembly. Thermal cycling of power on and off can cause earlier failure when a large mismatch is present.

See other pages where Signal routing is mentioned: [Pg.281]    [Pg.129]    [Pg.462]    [Pg.69]    [Pg.328]    [Pg.231]    [Pg.20]    [Pg.14]    [Pg.26]    [Pg.32]    [Pg.33]    [Pg.49]    [Pg.57]    [Pg.73]    [Pg.119]    [Pg.144]    [Pg.181]    [Pg.259]    [Pg.330]    [Pg.366]    [Pg.113]    [Pg.440]    [Pg.43]    [Pg.265]    [Pg.1274]    [Pg.1274]    [Pg.1459]    [Pg.1639]    [Pg.1948]    [Pg.1948]    [Pg.1950]    [Pg.1951]    [Pg.1965]    [Pg.314]    [Pg.325]    [Pg.335]    [Pg.350]    [Pg.369]    [Pg.633]    [Pg.909]   
See also in sourсe #XX -- [ Pg.81 ]




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