Rework of Underfill Flip-Chip Devices and Ball-Grid Array Packages

5 Rework of Underfill Flip-Chip Devices and Ball-Grid Array Packages 

Koschmieder, S., Thermal Phase A New Technique for Stencil/PCB Cleaning, SMT (Ftb. 1998) 

Removing Paste and Adhesive, Electronic Packaging and Production (Aug. 1999) 

and Turbini, L. J., Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conducive Anodic Filament Formation, Proc. Apex, San Diego, CA (Jan. 2002) 

Standard Test Method for Kauri-Butanol Value of Hydrocarbon Solvents, 

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Rework of underfill flip-chip devices and ball-grid-array packages 212 References 212... 

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