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Rework of underfill flip-chip devices and ball-grid-array packages 212 References 212... [Pg.144]

Rework of Underfill Flip-Chip Devices and Ball-Grid Array Packages... [Pg.256]

Biancomano, V.J., October 28, 1996, Ball-grid arrays all in a day s rework. Electronic Engineering Times, p. 49. [Pg.871]

See other pages where Ball grid array rework is mentioned: [Pg.407] [Pg.463] [Pg.474] [Pg.1136] [Pg.1021]

See also in sourсe #XX -- [ Pg.47 , Pg.48 , Pg.49 , Pg.50 ]