Reflow infrared soldering

PCT may be used for the production of electronic and automotive components such as circuit board components, connectors, switches and relays, and alternator armatures and pressure sensors. The main application has been in the fabrication of surface-mount connectors that can withstand infrared reflow soldering operations. 

Material such as plastic and ceramic component bodies, lead and pad metallurgies, solder, printed circuit board laminate, solder paste flux, and adhesives all absorb infrared radiation at different rates. Therefore, the direct radiative approach is known to cause overheating of some components and underheating of others. For this reason, direct IR heating is no longer the preferred method for reflow. 

INTERNAL LAYER A conductive pattern contained entirely within a mnltUayer board. IPC Institute for Interconnecting and Packaging Electronic Circuits. A leading printed wiring industry association that develops and distribntes standards as well as other information of value to printed wiring designers, users, suppliers, and fabricators. IR Infrared heating for solder-reflow operation. 

The heat transfer mechanisms utilized for the mass reflow soldering of electronic assemblies include convection, radiation (infrared sources), and condensation (vapor phase). The most popular solder reflow method is based on forced convection. 

Wu, C. A Knowledge Based Approach To Profile Identification In Surface Mount Infrared Reflow Soldering. Masters Thesis State University Of New York at Binghamton Binghamton, New York, 1992. 

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