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Protective fabric technologies

Q Personnel Protective Fabric Technologies for Chemical Countermeasures... [Pg.203]

Ramkumar SS, Sata U and Hussain M (2008), Chapter 8. Personnel protective fabric technologies for chemical countermeasures. In Advances In Biological... [Pg.138]

Typical fabrics showing varying levels of chemical protection to the NFPA 1991 and 1992 standards are typified by DuPont Tychem fabric technologies where, for instance, the following variants are a selection currently marketed ... [Pg.312]

Tyvek provides an ideal balance of protection, durability and comfort of any limited use fabric technology. Protection is built into the fabric itself there are no films or laminates to abrade or wear away. Applications include lead and asbestos abatement/remed-ation, general maintenance/operations, spray painting, general cleanup. DuPont, www. tyvekx om, (800) 44-TYVEK. CIkIb 2S0... [Pg.42]

Dual Protection Vests Made of Steel Reinforced Fibers, Defence Update, 1, 2004, http //defense-update.eom/products/d/Dyneema.htm. http //www.cordura.com/en/fabric-technology/balhstic-fabric.html. [Pg.133]

The modified mask method and the protection layer technology enable the simultaneous fabrication of geometrical structures of different depth, such as holes or slits and sack holes or trenches with predefined depths, in a single... [Pg.254]

Dielectric Film Deposition. Dielectric films are found in all VLSI circuits to provide insulation between conducting layers, as diffusion and ion implantation (qv) masks, for diffusion from doped oxides, to cap doped films to prevent outdiffusion, and for passivating devices as a measure of protection against external contamination, moisture, and scratches. Properties that define the nature and function of dielectric films are the dielectric constant, the process temperature, and specific fabrication characteristics such as step coverage, gap-filling capabihties, density stress, contamination, thickness uniformity, deposition rate, and moisture resistance (2). Several processes are used to deposit dielectric films including atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), or plasma-enhanced CVD (PECVD) (see Plasma technology). [Pg.347]

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Fabric technologies

Fabrication technology

Personnel protective fabric technologies

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