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Properties thermomechanical behavior

In this section we recall the reasons that we undertook the modeling efforts advocated in this book in the first place. Our end was to see to what extent one might explain the observed thermomechanical properties of real materials. Just what are these observations and what do they teach us We now take stock of the range of observed properties of relevance to the thermomechanical behavior of materials and the extent to which they have been understood both phenomenologically and mechanistically. [Pg.743]

The outstanding property of such PUR adhesive layers is their high elasticity or flexibility over a wide temperature range (approximately -40 to 80 °C). This thermomechanic behavior is the precondition for the application in car industry. [Pg.29]

Acrylate copolymers with complex linear or star architectures were prepared and characterized. Precise control over the sequence distribntion and overall composition of these materials was achieved by atom transfer radical polymerization. A strong correlation between the molecular stractme and composition of the copolymers and their thermomechanical behavior was foimd. This provides a new way for creating advanced materials with tailored properties. [Pg.297]

A detailed understanding of the underlying mechanisms for the SME requires a systematic characterization, especially quantification of the shape-memory properties. As typical for a material function, numerous physical parameters are in-fiuencing the SME. Therefore the determination of structure/physical parameter function relationships is challenging. Specific methods are required for dual-shape or triple-shape properties as well as for the different stimuli. The knowledge-based development of SMPs can be supported by modeling approaches for simulating the thermomechanical behavior of such polymers. [Pg.143]

In addition, an adjustment to the specific sample geometries in various applications is needed. There are a number of crucial aspects for a successful translation of SMP technology into industrial applications, such as a standardization of the different methods described for quantification of the shape-memory properties. The recently reported 3-D thermomechanical constitutive model assuming active and frozen phases, representing the multiphase character of thermoplastic SMPs can be an especially fruitful approach for the future development of finite element models for prediction of the thermomechanical behavior. [Pg.143]

Over the past few years, many attempts have been made to improve the thermomechanical properties of polymers by blending. Nonetheless, there remains a need for additional studies to widen the scope of knowledge of blending processes and the thermomechanical behavior of the related polymer blends. Although many studies have addressed the issue of creep polymers, investigations of the... [Pg.395]

Various chemical, structural, physical, in-sCTvice, and temperature-related tests for refractory materials have now been described. There is now a need to consider the combination of tests that provide us with properties, which additionally allow us to take that additional step from material test piece to a working refractory lining or component. This suite of tests allows us to study the thermomechanical behavior of materials and can be used in finite element modeling of refractory systems. [Pg.455]

Incorporation of dispersoids has been pursued to improve the mechanical and, particularly, thermomechanical behavior of solders and their service-temjjerature capability without significantly altering the processing parameters [16-19]. This chapter addresses the role of dispersoids, their requirements, methods to incorporate them in a solder, and their influence on the microstructure and properties. Prior studies have dealt with several aspects of dispersoids in leadbearing solders, which will be briefly reviewed as they provide the basis for developments in lead-free solder systems. [Pg.302]

The absorption of moisture critically affects other important resin properties, particularly those associated with low-dielectric and thermomechanical applications. Results of a 96-h boiling water immersion test are presented in Table 2.2. The moisture absorbed decreased substantially with fluoromethylene chain length from n = 3 to n = 6, followed by only modest decreases for n = 8 and 10. This latter behavior was somewhat unexpected and may be the effect of decreased cross-link density counteracting the increased fluorine content. These 100°C measurements are just above the glass transition and the situation may be different at room temperature. These measurements are in progress. [Pg.33]


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See also in sourсe #XX -- [ Pg.207 , Pg.210 ]




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