Process design primarily tools

Spindle runout has been demonstrated to be a significant factor limiting the life of PCBN tools. Many FSW machines built for aluminum alloys have relatively high spindle runout, because they were designed primarily to accommodate high process loads. Producers of PCBN tools have recognized the importance of precise spindles and specify a maximum spindle runout of 0.01 mm (0.0004 in.) (Ref 7). Failure to meet this spindle runout requirement has led to premature tool fracture. 

The genesis of in silico oral bioavailability predictions can be traced back to Lip-inski s Rule of Five and others qualitative attempts to describe drug-like molecules [13-15]. These processes are useful primarily as a qualitative tool in the early stage library design and in the candidate selection. Despite its large number of falsepositive results, Lipinski s Rule of Five has come into wide use as a qualitative tool to help the chemist design bioavailable compounds. It was concluded that compounds are most likely to have poor absorption when the molecular weight is >500, the calculated octan-l-ol/water partition coefficient (c log P) is >5, the number of H-bond donors is >5, and the number of H-bond acceptors is >10. Computation of these properties is now available as an ADME (absorption, distribution, metabolism, excretion) screen in commercial software such as Tsar (from Accelrys). The rule-of-5 should be seen as a qualitative, rather than quantitative, predictor of absorption and permeability [16, 17]. 

Improved semiconductor devices and circuits tend to be achieved primarily through advances in either device density, performance or functionality. At times, all three elements are realized simultaneously. The improvements can be accomplished in several ways. One approach is to design new circuit families, which very often create enhanced device functionalities and performances. In contrast to this, device density gains typically demand a much greater investment of process efforts in the form of a relentless pursuit of better tolerance control of all the various process and tool parameters. It may, however, also be coupled with the introduction of new process methods and/or tools with enhanced process capabilities. 

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